Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
GPHC3.0-0.040-02-0816

GPHC3.0-0.040-02-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BLUE

0

COH-1016LVC-400-20

COH-1016LVC-400-20

Taica Corporation

THERMAL INTERFACE PAD, GAP PAD,

0

V833-100-80-0.2

V833-100-80-0.2

t-Global Technology

PHASE CHANGE MATERIAL 100X80X0.2

0

TGF20-07870787-039

TGF20-07870787-039

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM BLUE

14

EYG-S0612ZLWF

EYG-S0612ZLWF

Panasonic

THERM PAD 120MMX60MM GRAY

19

SUPERTHERMAL-C128-10-00-1300-1300

SUPERTHERMAL-C128-10-00-1300-1300

Aavid

PAD SUPER C128 1MM 130X130MM

0

GPTGP7000ULM-0.125-02-0808

GPTGP7000ULM-0.125-02-0808

Henkel / Bergquist

GAP PAD 8X8" SHEET 0.125"

4

TG-AL373-10-5-0.5-0

TG-AL373-10-5-0.5-0

t-Global Technology

THERM PAD 10MMX5MM YELLOW

0

TG-A20KX-285-190-2.0

TG-A20KX-285-190-2.0

t-Global Technology

THERMAL PAD 285X190MM DARK GREY

5

SOFTFLEX-D021-20-01-4000-2000

SOFTFLEX-D021-20-01-4000-2000

Aavid

PAD SOFTFLEX D021 2MM 400X200MM

0

T62-1-100-100-0.16

T62-1-100-100-0.16

t-Global Technology

THERM PAD 100MMX100MM W/ADH BLK

0

TG-A3500-5-5-4.0

TG-A3500-5-5-4.0

t-Global Technology

THERM PAD A3500 5X5X4MM

833

TG-A6200-10-5-0.5

TG-A6200-10-5-0.5

t-Global Technology

THERMAL PAD 10X5MM BLUE

2649

TG-A1450-25-25-0.5

TG-A1450-25-25-0.5

t-Global Technology

THERM PAD A1450 25X25X0.5MM

187

A12617-25

A12617-25

Laird - Performance Materials

THERM PAD 457.2X457.2MM BLU/VIO

62

SF500G-414505

SF500G-414505

CUI Devices

THERMAL INTERFACE MATERIAL, SF50

0

CD-02-05-264

CD-02-05-264

Wakefield-Vette

THERM PAD 26.67MMX21.59MM ORANGE

0

TG-A20KX-285-190-0.5

TG-A20KX-285-190-0.5

t-Global Technology

THERMAL PAD 285X190MM DARK GREY

9

BS89-160-160-2.0

BS89-160-160-2.0

THERMAL PAD, SHEET 160X160MM, TH

24

TG-A1780-15-15-1.5

TG-A1780-15-15-1.5

t-Global Technology

THERM PAD A1780 15X15X1.5MM

34

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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