| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
|
Henkel / Bergquist |
THERM PAD 406.4MMX203.2MM BLUE |
0 |
|
|
|
Taica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
0 |
|
|
|
t-Global Technology |
PHASE CHANGE MATERIAL 100X80X0.2 |
0 |
|
|
|
Leader Tech Inc. |
THERM PAD 199.9MMX199.9MM BLUE |
14 |
|
|
|
Panasonic |
THERM PAD 120MMX60MM GRAY |
19 |
|
|
|
SUPERTHERMAL-C128-10-00-1300-1300 Aavid |
PAD SUPER C128 1MM 130X130MM |
0 |
|
|
|
Henkel / Bergquist |
GAP PAD 8X8" SHEET 0.125" |
4 |
|
|
|
t-Global Technology |
THERM PAD 10MMX5MM YELLOW |
0 |
|
|
|
t-Global Technology |
THERMAL PAD 285X190MM DARK GREY |
5 |
|
|
|
Aavid |
PAD SOFTFLEX D021 2MM 400X200MM |
0 |
|
|
|
t-Global Technology |
THERM PAD 100MMX100MM W/ADH BLK |
0 |
|
|
|
t-Global Technology |
THERM PAD A3500 5X5X4MM |
833 |
|
|
|
t-Global Technology |
THERMAL PAD 10X5MM BLUE |
2649 |
|
|
|
t-Global Technology |
THERM PAD A1450 25X25X0.5MM |
187 |
|
|
|
Laird - Performance Materials |
THERM PAD 457.2X457.2MM BLU/VIO |
62 |
|
|
|
CUI Devices |
THERMAL INTERFACE MATERIAL, SF50 |
0 |
|
|
|
Wakefield-Vette |
THERM PAD 26.67MMX21.59MM ORANGE |
0 |
|
|
|
t-Global Technology |
THERMAL PAD 285X190MM DARK GREY |
9 |
|
|
THERMAL PAD, SHEET 160X160MM, TH |
24 |
|
||
|
t-Global Technology |
THERM PAD A1780 15X15X1.5MM |
34 |
|
Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.
| Type | Functional Features | Application Examples |
|---|---|---|
| Silicone-Based Pads | High flexibility, low compression force, dielectric insulation | Smartphones, laptops, LED lighting |
| Non-Silicone Pads | Lower cost, reduced silicone oil migration | Power supplies, industrial controls |
| Phase Change Materials (PCM) | Softening at operational temperatures for better contact | CPUs, GPUs, servers |
| Metal-Backed Pads | Aluminum/copper reinforcement for structural support | EV battery packs, high-power lasers |
| Graphite Sheets | Ultra-thin, anisotropic heat spreading | 5G base stations, wearable devices |
Typical thermal pads consist of:
| Parameter | Importance |
|---|---|
| Thermal Conductivity (W/m K) | Measures heat transfer efficiency (ASTM D5470) |
| Thickness (mm) | Impacts contact resistance and compression force |
| Operating Temperature Range ( C) | Determines material stability under thermal stress |
| Hardness (Shore 00) | Affects conformability to surfaces |
| Adhesion Strength (N/mm ) | Critical for mechanical fixation |
| Electrical Insulation (kV/mm) | Essential for high-voltage applications |
Major industries include:
| Manufacturer | Representative Product | Key Specification |
|---|---|---|
| Laird Performance Materials | THERM-A-GAP GEL 15 | 15 W/m K, 0.5mm thickness |
| Bergquist (Henkel) | Gap Pad 1500S | Silicone-free, 8.0 W/m K |
| 3M | 5595 PCM | Phase change at 55 C, 12 W/m K |
| Fujipoly | SARCON Matrix MG | Metal-gel hybrid, 20 W/m K |
| Momentive | TSE 3045 | Graphite sheet, 400 W/m K (in-plane) |
Key considerations:
Emerging trends include: