Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A3500-160-160-2.0

TG-A3500-160-160-2.0

t-Global Technology

SILICONE THERMAL PAD 160X160X2.0

0

EYG-S0811ZLWG

EYG-S0811ZLWG

Panasonic

THERM PAD 108MMX78MM GRAY

309

TG-AL373-320-320-1.0-1A

TG-AL373-320-320-1.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

0

TG-A2200-10-10-1.5

TG-A2200-10-10-1.5

t-Global Technology

THERM PAD A2200 10X10X1.5MM

4003

A15038-003

A15038-003

Laird - Performance Materials

THERM PAD 25.4MMX19.05MM TAN

0

TG-A373L-320-320-5.0-0

TG-A373L-320-320-5.0-0

t-Global Technology

THERM PAD 320MMX320MM YELLOW

0

8926-05

8926-05

3M

THERMALLY CONDUCTIVE INTERFACE T

0

A17713-19

A17713-19

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM BLUE

5

TG-A20KF-285-190-0.5

TG-A20KF-285-190-0.5

t-Global Technology

THERMAL PAD 285X190MM DARK GREY

9

TG-A38KX-190-140-2.5

TG-A38KX-190-140-2.5

t-Global Technology

THERMAL PAD 190X140MM BLUE

10

COH-1016LVC-400-05

COH-1016LVC-400-05

Taica Corporation

THERMAL INTERFACE PAD, GAP PAD,

0

PL-05-1-1016

PL-05-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY

242

SF600G-414505

SF600G-414505

CUI Devices

THERMAL INTERFACE MATERIAL, SF60

0

A15896-12

A15896-12

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

34

3M 8805 CIRCLE-2

3M 8805 CIRCLE-2"-100

3M

THERM PAD 50.8MM DIA W/ADH WHITE

0

SF100S-101005

SF100S-101005

CUI Devices

THERMAL INTERFACE MATERIAL, SF10

0

PL-2-5-1016

PL-2-5-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD

194

TG-A3500-10-10-1.0

TG-A3500-10-10-1.0

t-Global Technology

THERM PAD A3500 10X10X1MM

155

HSP-3

HSP-3

Sensata Technologies – Crydom

THERM PAD 104.39MMX73.66MM WHITE

0

SF500-153005

SF500-153005

CUI Devices

THERMAL INTERFACE MATERIAL, SF50

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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