Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A486A-150-150-10.0-1A

TG-A486A-150-150-10.0-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH

7

PK404-160-160-2.0

PK404-160-160-2.0

THERMAL PAD, SHEET 160X160MM, TH

4

EYG-A121802DF

EYG-A121802DF

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

60-11-4661-T441-08

60-11-4661-T441-08

Parker Chomerics

CHO-THERM T441 DO-5 0.008"

422

TG-AH486-320-320-1.0-1A

TG-AH486-320-320-1.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH GRAY

478

A17775-04

A17775-04

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM BLUE

0

TG-A1780-20-20-0.5

TG-A1780-20-20-0.5

t-Global Technology

THERM PAD A1780 20X20X0.5MM

0

EYG-R1014ZRDB

EYG-R1014ZRDB

Panasonic

THERM PAD 138X98X0.35MM GRAY

10

PK223-320-320-3.5

PK223-320-320-3.5

THERMAL PAD, SHEET 320X320MM, TH

1

TG-A3500-40-40-0.5

TG-A3500-40-40-0.5

t-Global Technology

THERM PAD A3500 40X40X0.5MM

521

TG-AL375-150-150-2.0-1A

TG-AL375-150-150-2.0-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH GRAY

19

A17653-02

A17653-02

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM PINK

57

KK071CUT-1

KK071CUT-1

Carlo Gavazzi

THERMAL PAD 35MM X 42MM

366

AT910-320-320-0.15

AT910-320-320-0.15

THERMAL TAPE 320X320MM, THICK 0.

1

EYG-R0409ZRMG

EYG-R0409ZRMG

Panasonic

THERM PAD 41X88X0.35MM GRAY

20

TG-A4500-15-15-1.0

TG-A4500-15-15-1.0

t-Global Technology

THERM PAD A4500 15X15X1MM

1389

TG-A1780-30-30-1.0

TG-A1780-30-30-1.0

t-Global Technology

THERM PAD A1780 30X30X1MM

27

EYG-A121804DF

EYG-A121804DF

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

7

SF100S-151505

SF100S-151505

CUI Devices

THERMAL INTERFACE MATERIAL, SF10

0

SF100-265005

SF100-265005

CUI Devices

THERM PAD 26.25MMX50MM 1 SH=56PC

17

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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