Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A373L-300-300-0.5-0

TG-A373L-300-300-0.5-0

t-Global Technology

THERM PAD 300MMX300MM YELLOW

0

4170G

4170G

Aavid

THERM PAD 19.3MMX13.97MM

15960

N700A-160-160-1.0

N700A-160-160-1.0

THERMAL PAD, SHEET 160X160MM, TH

4

A10235-31

A10235-31

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM WHITE

66

TG-A373L-300-300-2.0-0

TG-A373L-300-300-2.0-0

t-Global Technology

THERM PAD 300MMX300MM YELLOW

0

TG-AL373-20-10-0.3-0

TG-AL373-20-10-0.3-0

t-Global Technology

THERM PAD 20MMX10MM YELLOW

0

A17174-10

A17174-10

Laird - Performance Materials

TFLEX P3100 18.00X18.00IN,

0

SF500G-313005

SF500G-313005

CUI Devices

THERMAL INTERFACE MATERIAL, SF50

0

TG-A1660-25-25-0.5

TG-A1660-25-25-0.5

t-Global Technology

THERM PAD A1660 25X25X0.5MM

14

A17747-04

A17747-04

Laird - Performance Materials

TFLEX P340 9.00X9.00IN

10

3M 9876-15 12

3M 9876-15 12" X 12"-SHEET

3M

THERMALLY CONDUCTIVE 12" X 12" 1

0

TG-AL375-150-150-5.0-0

TG-AL375-150-150-5.0-0

t-Global Technology

THERM PAD 150MMX150MM GRAY

19

SPK10-0.006-00-05

SPK10-0.006-00-05

Henkel / Bergquist

THERM PAD 41.91MMX28.96MM BEIGE

2104

TG-A4500F-100-100-2.5

TG-A4500F-100-100-2.5

t-Global Technology

THERMAL PAD 100X100MM PURPLE

7

TG-A1450-15-15-1.5

TG-A1450-15-15-1.5

t-Global Technology

THERM PAD A1450 15X15X1.5MM

61

PK223-160-160-3.5

PK223-160-160-3.5

THERMAL PAD, SHEET 160X160MM, TH

4

TG-A3500-20-20-0.5

TG-A3500-20-20-0.5

t-Global Technology

THERM PAD A3500 20X20X0.5MM

36

PK223-160-160-3.0

PK223-160-160-3.0

THERMAL PAD, SHEET 160X160MM, TH

4

COH-1016LVC-200-20-1NT

COH-1016LVC-200-20-1NT

Taica Corporation

THERMAL INTERFACE PAD, GAP PAD,

11

TG-A1250-40-40-2.0

TG-A1250-40-40-2.0

t-Global Technology

THERM PAD A1250 40X40X2MM

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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