| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
|
t-Global Technology |
THERM PAD 16MMX11.4MMX5.8MM GRAY |
0 |
|
|
|
Panasonic |
THERM PAD 48X55X0.35MM GRAY |
20 |
|
|
|
3M |
THERM PAD 19.05MMX10.54MM |
154 |
|
|
|
t-Global Technology |
THERM PAD 150MMX150MM W/ADH GRAY |
351 |
|
|
|
CUI Devices |
THERMAL INTERFACE MATERIAL, SF50 |
0 |
|
|
|
SUPERTHERMAL-A072-30-02-1400-1400 Aavid |
PAD SUPER A072 3MM 140X140MM |
0 |
|
|
|
t-Global Technology |
THERM PAD 300MMX300MM WHITE |
9 |
|
|
|
t-Global Technology |
THERM PAD 19.5MMX12.7MM RED |
72 |
|
|
|
Panasonic |
THERM PAD 180MMX115MM W/ADH GRAY |
0 |
|
|
THERMAL PAD, SHEET 320X320MM, TH |
1 |
|
||
|
t-Global Technology |
THERM PAD A1250 10X10X3MM |
419 |
|
|
|
Panasonic |
THERM PAD 69X136X0.25MM GRAY |
10 |
|
|
|
t-Global Technology |
THERMAL PAD 5X5MM BLUE |
15671 |
|
|
|
t-Global Technology |
THERM PAD 100MMX100MM YELLOW |
0 |
|
|
|
Panasonic |
THERM PAD 70MMX70MM W/ADH BLACK |
0 |
|
|
|
Henkel / Bergquist |
THERM PAD 406.4MMX203.2MM BLUE |
0 |
|
|
|
Parker Chomerics |
CHO-THERM T500 TO-220 0.010" ADH |
450 |
|
|
|
Taica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
0 |
|
|
|
t-Global Technology |
THERM PAD 150MMX150MM W/ADH GRAY |
3 |
|
|
|
t-Global Technology |
THERM PAD 230MMX230MM WHITE |
34 |
|
Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.
| Type | Functional Features | Application Examples |
|---|---|---|
| Silicone-Based Pads | High flexibility, low compression force, dielectric insulation | Smartphones, laptops, LED lighting |
| Non-Silicone Pads | Lower cost, reduced silicone oil migration | Power supplies, industrial controls |
| Phase Change Materials (PCM) | Softening at operational temperatures for better contact | CPUs, GPUs, servers |
| Metal-Backed Pads | Aluminum/copper reinforcement for structural support | EV battery packs, high-power lasers |
| Graphite Sheets | Ultra-thin, anisotropic heat spreading | 5G base stations, wearable devices |
Typical thermal pads consist of:
| Parameter | Importance |
|---|---|
| Thermal Conductivity (W/m K) | Measures heat transfer efficiency (ASTM D5470) |
| Thickness (mm) | Impacts contact resistance and compression force |
| Operating Temperature Range ( C) | Determines material stability under thermal stress |
| Hardness (Shore 00) | Affects conformability to surfaces |
| Adhesion Strength (N/mm ) | Critical for mechanical fixation |
| Electrical Insulation (kV/mm) | Essential for high-voltage applications |
Major industries include:
| Manufacturer | Representative Product | Key Specification |
|---|---|---|
| Laird Performance Materials | THERM-A-GAP GEL 15 | 15 W/m K, 0.5mm thickness |
| Bergquist (Henkel) | Gap Pad 1500S | Silicone-free, 8.0 W/m K |
| 3M | 5595 PCM | Phase change at 55 C, 12 W/m K |
| Fujipoly | SARCON Matrix MG | Metal-gel hybrid, 20 W/m K |
| Momentive | TSE 3045 | Graphite sheet, 400 W/m K (in-plane) |
Key considerations:
Emerging trends include: