Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A2200-45-45-1.5

TG-A2200-45-45-1.5

t-Global Technology

THERMAL PAD 45X45MM GREY

157

TG-A373L-150-150-5.0-1A

TG-A373L-150-150-5.0-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH YLW

0

GPHC3.0-0.080-02-0816

GPHC3.0-0.080-02-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BLUE

0

T69-225-225-0.05-0

T69-225-225-0.05-0

t-Global Technology

THERM PAD 225MMX225MM GRAY

0

TG-A2200-30-30-1.0

TG-A2200-30-30-1.0

t-Global Technology

THERMAL PAD 30X30MM GREY

83

A17752-20

A17752-20

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

3

SF400-303005

SF400-303005

CUI Devices

THERM PAD 30MMX30MM 1 SHEET=84PC

10

TG-A4040-300-300-2.0

TG-A4040-300-300-2.0

t-Global Technology

THERM PAD 300MMX300MM BLUE

0

TG-A2030-25-25-1.0

TG-A2030-25-25-1.0

t-Global Technology

THERM PAD 25MMX25MM WHITE

467

TG-AH482-150-150-5.0-0

TG-AH482-150-150-5.0-0

t-Global Technology

THERM PAD 150MMX150MM RED

46

DC0001/01-TG-A482K-0.1-0

DC0001/01-TG-A482K-0.1-0

t-Global Technology

THERM PAD 39.70MM X 26.67MM RED

32

EYG-S0512ZLGE

EYG-S0512ZLGE

Panasonic

THERM PAD 118MMX53MM GRAY

25

SF600G-153005

SF600G-153005

CUI Devices

THERMAL INTERFACE MATERIAL, SF60

0

EYG-R0612ZLSF

EYG-R0612ZLSF

Panasonic

THERM PAD 63.3X124X0.25MM GRAY

20

TG-A373S-320-320-3.0-1A

TG-A373S-320-320-3.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

6

N700C-320-320-3.5

N700C-320-320-3.5

THERMAL PAD, SHEET 320X320MM, TH

1

DC0001/14-TG-A486G-0.3-2A

DC0001/14-TG-A486G-0.3-2A

t-Global Technology

THERM PAD 45.21MMX31.75MM W/ADH

0

A17916-07

A17916-07

Laird - Performance Materials

TFLEX B270 9X9IN

272

TW-T400-01-10

TW-T400-01-10

3G Shielding Specialties

THERMAL INTERFACE MATERIAL

20

TG-A373L-150-150-0.5-2A

TG-A373L-150-150-0.5-2A

t-Global Technology

THERM PAD 150MMX150MM W/ADH YLW

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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