Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A6200-30-30-5.0

TG-A6200-30-30-5.0

t-Global Technology

THERM PAD A6200 30X30X5MM

72

TG-A38KF-190-140-2.0

TG-A38KF-190-140-2.0

t-Global Technology

THERMAL PAD 190X140MM BLUE

10

TG-A4500F-320-320-5.0

TG-A4500F-320-320-5.0

t-Global Technology

THERMAL PAD 320X320MM PURPLE

10

EYG-R0611ZLWH

EYG-R0611ZLWH

Panasonic

THERM PAD 60X106X0.25MM GRAY

14

EYG-R0409ZRGJ

EYG-R0409ZRGJ

Panasonic

THERM PAD 44X93X0.35MM GRAY

20

17.78MM-22.86MM-25-8810

17.78MM-22.86MM-25-8810

3M

THERM PAD 22.86MMX17.78MM 1=25PK

0

LI2000-150-150-0.15

LI2000-150-150-0.15

t-Global Technology

THERM PAD 150MMX150MM W/ADH WHT

34

45.97MM-45.97MM-25-8810

45.97MM-45.97MM-25-8810

3M

THERM PAD 45.97MMX45.97MM 1=25PK

0

TG-A2200-24-21.01-2.0

TG-A2200-24-21.01-2.0

t-Global Technology

THERMAL PAD 24X21.01MM GREY

750

4671

4671

Keystone Electronics Corp.

THERM PAD 20.32MMX12.83MM

474097400

EYG-A121807K

EYG-A121807K

Panasonic

THERM PAD 180MMX115MM GRAY

0

173-7-240A

173-7-240A

Wakefield-Vette

THERM PAD 19.1MMX12.7MM W/ADH

4966

A14692-30

A14692-30

Laird - Performance Materials

THERM PAD 457.2MMX279.4MM AMBER

330

TG-A373S-100-100-2.0-1A

TG-A373S-100-100-2.0-1A

t-Global Technology

THERM PAD 100MMX100MM W/ADH YLW

0

EYG-R0813ZRMD

EYG-R0813ZRMD

Panasonic

THERM PAD 71X123X0.35MM GRAY

10

9.52MM-9.52MM-25-8810

9.52MM-9.52MM-25-8810

3M

THERM PAD 9.52MMX9.52MM 1=25/PK

0

TG-APC93-320-320-1.5-0

TG-APC93-320-320-1.5-0

t-Global Technology

NON-SILICONE THERMAL PAD 320X320

0

TG-A1780-10-10-1.5

TG-A1780-10-10-1.5

t-Global Technology

THERM PAD A1780 10X10X1.5MM

197

A17690-14

A17690-14

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM PINK

3

60-12-8302-1671

60-12-8302-1671

Parker Chomerics

CHO-THERM 1671 TO-220 W/ADH

826

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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