Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
FS3L25R12W2H3B11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 40A 175W	15
FS100R12KE3BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 140A 480W	34
IFF2400P17LE4BPSA1 IR (Infineon Technologies)	IFF2400P17 - AC/DC POWER MODULES	3
APTGL60TL120T3G Roving Networks / Microchip Technology	IGBT MODULE 1200V 80A 280W SP3	0
FP150R12KT4PBPSA1 IR (Infineon Technologies)	IGBT MODULE 1200V 150A	6
APT35GT120JU2 Roving Networks / Microchip Technology	IGBT MOD 1200V 55A 260W SOT227	0
MG12225WB-BN2MM Wickmann / Littelfuse	IGBT MODULE 1200V 325A 1050W WB	0
F3L400R12PT4PB26BOSA1 IR (Infineon Technologies)	F3L400R12 - IGBT MODULE	4
FF150R12KT3GHOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 225A 780W	9
F475R06W1E3BOMA1 IR (Infineon Technologies)	IGBT MOD 600V 100A 275W	24
IXDN75N120 Wickmann / Littelfuse	IGBT MOD 1200V 150A 660W SOT227B	22
FD200R12PT4B6BOSA1 IR (Infineon Technologies)	FD200R12 - IGBT MODULE	86
VS-ETF075Y60U Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 109A EMIPAK-2B	0
A2P75S12M3 STMicroelectronics	IGBT MOD 1200V 75A ACEPACK2	18
FP50R12KT4B11BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 50A 280W	4
F3L400R07ME4B23BOSA1 IR (Infineon Technologies)	F3L400R07 - IGBT MODULE	20
APTGT75A60T1G Roving Networks / Microchip Technology	IGBT MODULE 600V 100A 250W SP1	0
FS75R12KE3BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 105A 350W	6
DF80R07W1H5FPB11BPSA1 IR (Infineon Technologies)	LOW POWER EASY	0
FZ600R12KE4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 600A 3000W	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability