Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APTGT100DA60T1G Roving Networks / Microchip Technology	IGBT MODULE 600V 150A 340W SP1	0
GSID200A120S5C1 SemiQ	IGBT MODULE 1200V 335A	0
FZ1800R12HP4B9HOSA2 IR (Infineon Technologies)	FZ1800R12 - IGBT MODULE	376
FS75R12KT4BPSA1 IR (Infineon Technologies)	GBT MODULE 1200V 75A	0
FS75R12W2T4B11BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 107A 375W	14
FS660R08A6P2FBBPSA1 IR (Infineon Technologies)	HYBRID PACK DRIVE	0
F3L200R12N2H3B47BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 200A 20MW ECONO	0
FF200R12KT3EHOSA1 IR (Infineon Technologies)	FF200R12 - IGBT MODULE	4
MG1275W-XN2MM Wickmann / Littelfuse	IGBT MOD 1200V 105A 368W	0
A1P50S65M2 STMicroelectronics	IGBT MOD 650V 50A 208W ACEPACK1	36
DD1200S12H4HOSA1 IR (Infineon Technologies)	IGBT MODULE 1200V 1200A	0
APTGT300SK60D3G Roving Networks / Microchip Technology	IGBT MODULE 600V 400A 940W D3	97
FP150R12KT4B11BPSA1 IR (Infineon Technologies)	FP150R12 - IGBT MODULE	5
FS450R17KE4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 600A 2500W	0
F450R12KS4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 70A 355W	10
IXYN82N120C3 Wickmann / Littelfuse	IGBT MOD 1200V 105A 500W SOT227B	270
APT70GR120JD60 Roving Networks / Microchip Technology	IGBT MOD 1200V 112A 543W SOT227	20
FZ600R17KE4HOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 1200A 3350W	34
FF1800R12IE5PBPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 1800A 20MW	3
IXXN110N65B4H1 Wickmann / Littelfuse	IGBT MOD 650V 215A 750W SOT227B	322

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability