Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
VN2410L-G-P013

VN2410L-G-P013

Roving Networks / Microchip Technology

MOSFET N-CH 240V 190MA TO92-3

0

APT10M25BVRG

APT10M25BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 100V 75A TO247

0

APT56M50L

APT56M50L

Roving Networks / Microchip Technology

MOSFET N-CH 500V 56A TO264

80

MSC750SMA170S

MSC750SMA170S

Roving Networks / Microchip Technology

TRANS SJT 1700V D3PAK

1

APT100F50J

APT100F50J

Roving Networks / Microchip Technology

MOSFET N-CH 500V 103A ISOTOP

0

APT14F100B

APT14F100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A TO247

0

APT20M11JVFR

APT20M11JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 200V 175A ISOTOP

0

APT47N60BC3G

APT47N60BC3G

Roving Networks / Microchip Technology

MOSFET N-CH 600V 47A TO247

63

APT5014BLLG

APT5014BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 35A TO247

0

APT75F50L

APT75F50L

Roving Networks / Microchip Technology

MOSFET N-CH 500V 75A TO264

0

APT5015SVFRG

APT5015SVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 32A D3PAK

120

APT29F100L

APT29F100L

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 30A TO264

0

APT60M80L2VRG

APT60M80L2VRG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 65A 264 MAX

0

TN2106N3-G

TN2106N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 300MA TO92-3

1497

TP2104N3-G

TP2104N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 40V 175MA TO92-3

184

TN0110N3-G

TN0110N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 100V 350MA TO92-3

772

VN2406L-G

VN2406L-G

Roving Networks / Microchip Technology

MOSFET N-CH 240V 190MA TO92-3

379

APT6021BLLG

APT6021BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 29A TO247

0

APL602B2G

APL602B2G

Roving Networks / Microchip Technology

MOSFET N-CH 600V 49A T-MAX

0

APT45M100J

APT45M100J

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 45A SOT227

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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