Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
MCP87090T-U/LC

MCP87090T-U/LC

Roving Networks / Microchip Technology

MOSFET N-CH 25V 48A 8PDFN

2376

APT7M120B

APT7M120B

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 8A TO247

2043

APT10M11JVFR

APT10M11JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 100V 144A ISOTOP

0

APT77N60SC6

APT77N60SC6

Roving Networks / Microchip Technology

MOSFET N-CH 600V 77A D3PAK

0

VN2222LL-G-P003

VN2222LL-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 60V 230MA TO92-3

373

APT34M60B

APT34M60B

Roving Networks / Microchip Technology

MOSFET N-CH 600V 36A TO247

0

APT5015BVRG

APT5015BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 32A TO247

0

APT50M75JLLU3

APT50M75JLLU3

Roving Networks / Microchip Technology

MOSFET N-CH 500V 51A SOT227

0

APT10086BVFRG

APT10086BVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 13A TO247

0

APT50M38JFLL

APT50M38JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 500V 88A ISOTOP

0

APT20M38BVRG

APT20M38BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 67A TO247

0

MSC025SMA120S

MSC025SMA120S

Roving Networks / Microchip Technology

SICFET N-CH 1.2KV 100A D3PAK

307

APT10M11JVRU2

APT10M11JVRU2

Roving Networks / Microchip Technology

MOSFET N-CH 100V 142A SOT227

0

APT20M22JVRU2

APT20M22JVRU2

Roving Networks / Microchip Technology

MOSFET N-CH 200V 97A SOT227

0

TN0604N3-G

TN0604N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 40V 700MA TO92-3

1056

APT50M65JFLL

APT50M65JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 500V 58A ISOTOP

0

APT6025SVRG

APT6025SVRG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 25A D3PAK

0

APT24M80S

APT24M80S

Roving Networks / Microchip Technology

MOSFET N-CH 800V 25A D3PAK

0

APT8014L2FLLG

APT8014L2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 52A 264 MAX

0

LND150N3-G-P013

LND150N3-G-P013

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30MA TO92-3

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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