Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT10035B2FLLG

APT10035B2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 28A T-MAX

0

APT20M22JVRU3

APT20M22JVRU3

Roving Networks / Microchip Technology

MOSFET N-CH 200V 97A SOT227

0

VN2450N3-G

VN2450N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 500V 200MA TO92-3

617

APT10M11JVRU3

APT10M11JVRU3

Roving Networks / Microchip Technology

MOSFET N-CH 100V 142A SOT227

1

APT84F50B2

APT84F50B2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 84A T-MAX

0

APT56F60B2

APT56F60B2

Roving Networks / Microchip Technology

MOSFET N-CH 600V 60A T-MAX

0

APT26F120L

APT26F120L

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 27A TO264

0

APT1201R5BVFRG

APT1201R5BVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 10A TO247

0

APT34M60S

APT34M60S

Roving Networks / Microchip Technology

MOSFET N-CH 600V 36A D3PAK

120

MSC130SM120JCU2

MSC130SM120JCU2

Roving Networks / Microchip Technology

TRANS SJT N-CH 1.2KV 173A SOT227

0

APT5017SVRG

APT5017SVRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30A D3PAK

0

APT5018SFLLG

APT5018SFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 27A D3PAK

0

VN2410L-G

VN2410L-G

Roving Networks / Microchip Technology

MOSFET N-CH 240V 190MA TO92-3

622

APT56M50B2

APT56M50B2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 56A T-MAX

0

DN2625K4-G

DN2625K4-G

Roving Networks / Microchip Technology

MOSFET N-CH 250V 1.1A TO252

0

APT58M50JCU2

APT58M50JCU2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 58A SOT227

0

VN0104N3-G-P013

VN0104N3-G-P013

Roving Networks / Microchip Technology

MOSFET N-CH 40V 350MA TO92-3

0

APT22F80S

APT22F80S

Roving Networks / Microchip Technology

MOSFET N-CH 800V 23A D3PAK

0

APT10090BLLG

APT10090BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 12A TO247

475

DN2530N3-G

DN2530N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 300V 175MA TO92

2937

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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