Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT47F60J

APT47F60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 49A ISOTOP

0

APT38N60BC6

APT38N60BC6

Roving Networks / Microchip Technology

MOSFET N-CH 600V 38A TO247

90

APT42F50B

APT42F50B

Roving Networks / Microchip Technology

MOSFET N-CH 500V 42A TO247

173

APT56M60L

APT56M60L

Roving Networks / Microchip Technology

MOSFET N-CH 600V 60A TO264

0

2N7000-G

2N7000-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 200MA TO92-3

623

VP2206N3-G

VP2206N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 60V 640MA TO92-3

640

APT12067LFLLG

APT12067LFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 18A TO264

0

APT6029BFLLG

APT6029BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 21A TO247

0

TN5325N3-G

TN5325N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 250V 215MA TO92-3

733

APT10026JFLL

APT10026JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 30A ISOTOP

0

TP2635N3-G

TP2635N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 350V 180MA TO92-3

98

VN10KN3-G-P013

VN10KN3-G-P013

Roving Networks / Microchip Technology

MOSFET N-CH 60V 310MA TO92-3

0

APT43F60B2

APT43F60B2

Roving Networks / Microchip Technology

MOSFET N-CH 600V 45A T-MAX

0

APT5024SLLG

APT5024SLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 22A D3PAK

0

APT34M120J

APT34M120J

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 35A SOT227

0

APL502B2G

APL502B2G

Roving Networks / Microchip Technology

MOSFET N-CH 500V 58A T-MAX

0

APT1003RSLLG

APT1003RSLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 4A D3PAK

0

APT39F60J

APT39F60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 42A ISOTOP

0

APT30M19JVR

APT30M19JVR

Roving Networks / Microchip Technology

MOSFET N-CH 300V 130A ISOTOP

0

VP0550N3-G-P013

VP0550N3-G-P013

Roving Networks / Microchip Technology

MOSFET P-CH 500V 54MA TO92-3

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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