Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT12060LVFRG

APT12060LVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 20A TO264

0

TN2106K1-G

TN2106K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 280MA TO236AB

9556

APT50M50L2LLG

APT50M50L2LLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 89A 264 MAX

0

APT5010LVFRG

APT5010LVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 47A TO264

0

APT20M16LFLLG

APT20M16LFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 100A TO264

0

APT8020B2LLG

APT8020B2LLG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 38A T-MAX

0

DN3545N8-G

DN3545N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 450V 200MA TO243AA

0

APT75M50B2

APT75M50B2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 75A T-MAX

0

MSC180SMA120S

MSC180SMA120S

Roving Networks / Microchip Technology

MOSFET SIC 1200 V 180 MOHM TO-26

150

MSC70SM120JCU2

MSC70SM120JCU2

Roving Networks / Microchip Technology

TRANS SJT N-CH 1.2KV 89A SOT227

39

APT40M35JVR

APT40M35JVR

Roving Networks / Microchip Technology

MOSFET N-CH 400V 93A SOT227

29

APT84M50B2

APT84M50B2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 84A T-MAX

0

MSC035SMA070S

MSC035SMA070S

Roving Networks / Microchip Technology

MOSFET N-CH 700V D3PAK

121

APT77N60JC3

APT77N60JC3

Roving Networks / Microchip Technology

MOSFET N-CH 600V 77A ISOTOP

233

APT8020LLLG

APT8020LLLG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 38A TO264

0

APT5010B2FLLG

APT5010B2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 46A T-MAX

3

APT10035JLL

APT10035JLL

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 25A ISOTOP

0

APT10035LFLLG

APT10035LFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 28A TO264

0

APT5015BVFRG

APT5015BVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 32A TO247

0

APL602J

APL602J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 43A ISOTOP

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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