Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT6030BVRG

APT6030BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 21A TO247

0

APT58F50J

APT58F50J

Roving Networks / Microchip Technology

MOSFET N-CH 500V 58A ISOTOP

0

APT40M70JVR

APT40M70JVR

Roving Networks / Microchip Technology

MOSFET N-CH 400V 53A SOT227

50

APT60M75JLL

APT60M75JLL

Roving Networks / Microchip Technology

MOSFET N-CH 600V 58A ISOTOP

0

APT8011JLL

APT8011JLL

Roving Networks / Microchip Technology

MOSFET N-CH 800V 51A ISOTOP

0

VP2450N3-G

VP2450N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 500V 100MA TO92-3

438

APT1003RSFLLG

APT1003RSFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 4A D3PAK

0

APT47M60J

APT47M60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 49A ISOTOP

10

MSC080SMA120J

MSC080SMA120J

Roving Networks / Microchip Technology

SICFET N-CH 1.2KV 35A SOT227

99

VP3203N8-G

VP3203N8-G

Roving Networks / Microchip Technology

MOSFET P-CH 30V 1.1A TO243AA

312

APT50M75JFLL

APT50M75JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 500V 51A ISOTOP

0

TN0610N3-G-P003

TN0610N3-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 100V 500MA TO92-3

0

APT30M85BVRG

APT30M85BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 300V 40A TO247

0

APT1201R6BVFRG

APT1201R6BVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 8A TO247

0

APT5010LLLG

APT5010LLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 46A TO264

49

APT84M50L

APT84M50L

Roving Networks / Microchip Technology

MOSFET N-CH 500V 84A TO264

17

APT8024LFLLG

APT8024LFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 31A TO264

0

MSC040SMA120S

MSC040SMA120S

Roving Networks / Microchip Technology

SICFET N-CH 1200V 64A TO268

6

LP0701LG-G

LP0701LG-G

Roving Networks / Microchip Technology

MOSFET P-CH 16.5V 700MA 8SOIC

2718

APT14M100B

APT14M100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A TO247

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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