Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TP5322N8-G

TP5322N8-G

Roving Networks / Microchip Technology

MOSFET P-CH 220V 260MA TO243AA

0

APT43M60B2

APT43M60B2

Roving Networks / Microchip Technology

MOSFET N-CH 600V 45A T-MAX

0

TP2104N3-G-P003

TP2104N3-G-P003

Roving Networks / Microchip Technology

MOSFET P-CH 40V 175MA TO92-3

0

MSC015SMA070S

MSC015SMA070S

Roving Networks / Microchip Technology

SICFET N-CH 700V 166A D3PAK

175

APT18M100S

APT18M100S

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 18A D3PAK

180

APT5010B2LLG

APT5010B2LLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 46A T-MAX

0

APT18M80B

APT18M80B

Roving Networks / Microchip Technology

MOSFET N-CH 800V 19A TO247

20

MCP87130T-U/MF

MCP87130T-U/MF

Roving Networks / Microchip Technology

MOSFET N-CH 25V 43A 8PDFN

2449

APT4F120S

APT4F120S

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 4A D3PAK

32

APT8015JVFR

APT8015JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 800V 44A ISOTOP

0

APT75M50L

APT75M50L

Roving Networks / Microchip Technology

MOSFET N-CH 500V 75A TO264

13

APT10078SLLG

APT10078SLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A D3PAK

0

TP0606N3-G-P003

TP0606N3-G-P003

Roving Networks / Microchip Technology

MOSFET P-CH 60V 320MA TO92-3

0

APT30M36JLL

APT30M36JLL

Roving Networks / Microchip Technology

MOSFET N-CH 300V 76A ISOTOP

0

DN2540N5-G

DN2540N5-G

Roving Networks / Microchip Technology

MOSFET N-CH 400V 500MA TO220-3

0

APT6010JLL

APT6010JLL

Roving Networks / Microchip Technology

MOSFET N-CH 600V 47A ISOTOP

0

VN0104N3-G

VN0104N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 40V 350MA TO92-3

1533

LND150N3-G-P002

LND150N3-G-P002

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30MA TO92-3

0

APT5010LVRG

APT5010LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 47A TO264

0

APT9F100B

APT9F100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 9A TO247

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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