Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT41F100J

APT41F100J

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 42A ISOTOP

72

APL502LG

APL502LG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 58A TO264

41

APT84F50L

APT84F50L

Roving Networks / Microchip Technology

MOSFET N-CH 500V 84A TO264

0

APT43F60L

APT43F60L

Roving Networks / Microchip Technology

MOSFET N-CH 600V 45A TO264

0

APT48M80L

APT48M80L

Roving Networks / Microchip Technology

MOSFET N-CH 800V 49A TO264

6

APT20M18LVFRG

APT20M18LVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 100A TO264

0

APL602LG

APL602LG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 49A TO264

0

APT8011JFLL

APT8011JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 800V 51A ISOTOP

0

TN0702N3-G

TN0702N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 20V 530MA TO92-3

1018

APT1201R4SFLLG

APT1201R4SFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 9A D3PAK

0

TP2104K1-G

TP2104K1-G

Roving Networks / Microchip Technology

MOSFET P-CH 40V 160MA TO236AB

2199

VN2222LL-G

VN2222LL-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 230MA TO92-3

1782

DN3535N8-G

DN3535N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 350V 230MA TO243AA

0

APT6038BFLLG

APT6038BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 17A TO247

0

APT10026JLL

APT10026JLL

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 30A ISOTOP

0

APT50M75B2LLG

APT50M75B2LLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 57A T-MAX

0

MSC080SMA120B

MSC080SMA120B

Roving Networks / Microchip Technology

SICFET N-CH 1200V 37A TO247-3

26

VN1206L-G

VN1206L-G

Roving Networks / Microchip Technology

MOSFET N-CH 120V 230MA TO92-3

375

APT10026L2FLLG

APT10026L2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 38A 264 MAX

264

APT30M36B2FLLG

APT30M36B2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 300V 84A T-MAX

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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