Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT30M36JFLL

APT30M36JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 300V 76A ISOTOP

0

APT6029BLLG

APT6029BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 21A TO247

0

APT10045JLL

APT10045JLL

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 21A ISOTOP

0

TP0606N3-G-P002

TP0606N3-G-P002

Roving Networks / Microchip Technology

MOSFET P-CH 60V 320MA TO92-3

0

VP2206N2

VP2206N2

Roving Networks / Microchip Technology

MOSFET P-CH 60V 750MA TO39

353

TP2502N8-G

TP2502N8-G

Roving Networks / Microchip Technology

MOSFET P-CH 20V 630MA TO243AA

1841

TN2540N3-G

TN2540N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 400V 175MA TO92-3

322

APT60N60BCSG

APT60N60BCSG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 60A TO247

243

APT106N60LC6

APT106N60LC6

Roving Networks / Microchip Technology

MOSFET N-CH 600V 106A TO264

148

APT44F80B2

APT44F80B2

Roving Networks / Microchip Technology

MOSFET N-CH 800V 47A T-MAX

1

APT75F50B2

APT75F50B2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 75A T-MAX

0

APT47N60SC3G

APT47N60SC3G

Roving Networks / Microchip Technology

MOSFET N-CH 600V 47A D3PAK

16

APT30F50B

APT30F50B

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30A TO247

102

APT9M100S

APT9M100S

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 9A D3PAK

158

APT17F100B

APT17F100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 17A TO247

37

DN3545N3-G

DN3545N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 450V 136MA TO92

3008

TN0106N3-G-P003

TN0106N3-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 60V 350MA TO92-3

0

APT5014SLLG

APT5014SLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 35A D3PAK

0

LND150N3-G-P014

LND150N3-G-P014

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30MA TO92-3

0

TN2124K1-G

TN2124K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 240V 134MA TO236AB

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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