Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
VN2110K1-G Roving Networks / Microchip Technology	MOSFET N-CH 100V 200MA SOT23-3	2998
APT34F60S Roving Networks / Microchip Technology	MOSFET N-CH 600V 36A D3PAK	120
VN2106N3-G Roving Networks / Microchip Technology	MOSFET N-CH 60V 300MA TO92-3	1326
APT8020B2FLLG Roving Networks / Microchip Technology	MOSFET N-CH 800V 38A T-MAX	0
APT12057JFLL Roving Networks / Microchip Technology	MOSFET N-CH 1200V 19A ISOTOP	0
APT40N60JCU3 Roving Networks / Microchip Technology	MOSFET N-CH 600V 40A SOT227	0
APT10026L2LLG Roving Networks / Microchip Technology	MOSFET N-CH 1000V 38A 264 MAX	0
TP5322K1-G Roving Networks / Microchip Technology	MOSFET P-CH 220V 120MA TO236AB	1405
APT56M60B2 Roving Networks / Microchip Technology	MOSFET N-CH 600V 60A TO247	0
APT100MC120JCU2 Roving Networks / Microchip Technology	SICFET N-CH 1200V 143A SOT227	3
VN2450N8-G Roving Networks / Microchip Technology	MOSFET N-CH 500V 250MA TO243AA	2000
APT1001RBVRG Roving Networks / Microchip Technology	MOSFET N-CH 1000V 11A TO247	0
APTM50UM09FAG Roving Networks / Microchip Technology	MOSFET N-CH 500V 497A SP6	0
TN0610N3-G-P013 Roving Networks / Microchip Technology	MOSFET N-CH 100V 500MA TO92-3	0
APT43M60L Roving Networks / Microchip Technology	MOSFET N-CH 600V 45A TO264	24
DN3765K4-G Roving Networks / Microchip Technology	MOSFET N-CH 650V 300MA TO252-3	317
2N6660 Roving Networks / Microchip Technology	MOSFET N-CH 60V 410MA TO39	244
TP2520N8-G Roving Networks / Microchip Technology	MOSFET P-CH 200V 260MA TO243AA	0
APT1201R2BFLLG Roving Networks / Microchip Technology	MOSFET N-CH 1200V 12A TO247	0
APT10050B2VFRG Roving Networks / Microchip Technology	MOSFET N-CH 1000V 21A T-MAX	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS