Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFN94N50P2

IXFN94N50P2

Wickmann / Littelfuse

MOSFET N-CH 500V 68A SOT227B

0

IXTK102N30P

IXTK102N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 102A TO264

950

IXTA50N20P

IXTA50N20P

Wickmann / Littelfuse

MOSFET N-CH 200V 50A TO263

450

IXFB210N20P

IXFB210N20P

Wickmann / Littelfuse

MOSFET N-CH 200V 210A PLUS264

1800

IXTA10P15T-TRL

IXTA10P15T-TRL

Wickmann / Littelfuse

MOSFET P-CH 150V 10A TO263

1600

IXTB62N50L

IXTB62N50L

Wickmann / Littelfuse

MOSFET N-CH 500V 62A PLUS264

1111050

IXTX22N100L

IXTX22N100L

Wickmann / Littelfuse

MOSFET N-CH 1000V 22A PLUS247-3

0

IXTP44P15T

IXTP44P15T

Wickmann / Littelfuse

MOSFET P-CH 150V 44A TO220AB

565

IXTH10P50P

IXTH10P50P

Wickmann / Littelfuse

MOSFET P-CH 500V 10A TO247

89

IXFK240N25X3

IXFK240N25X3

Wickmann / Littelfuse

MOSFET N-CH 250V 240A TO264

13

IXFT30N85XHV

IXFT30N85XHV

Wickmann / Littelfuse

MOSFET N-CH 850V 30A TO268

930

CPC3708CTR

CPC3708CTR

Wickmann / Littelfuse

MOSFET N-CH 350V 5MA SOT89

1000

IXTA36P15P-TRL

IXTA36P15P-TRL

Wickmann / Littelfuse

MOSFET P-CH 150V 36A TO263

1229

IXFX64N50P

IXFX64N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 64A PLUS247-3

0

IXTP15N50L2

IXTP15N50L2

Wickmann / Littelfuse

MOSFET N-CH 500V 15A TO220AB

276

IXFN210N30P3

IXFN210N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 192A SOT227B

0

IXTP08N50D2

IXTP08N50D2

Wickmann / Littelfuse

MOSFET N-CH 500V 800MA TO220AB

183600

IXTA86N20X4

IXTA86N20X4

Wickmann / Littelfuse

MOSFET 200V 86A N-CH ULTRA TO263

1000

IXTT10P60

IXTT10P60

Wickmann / Littelfuse

MOSFET P-CH 600V 10A TO268

2070

IXFA3N120

IXFA3N120

Wickmann / Littelfuse

MOSFET N-CH 1200V 3A TO263

3041250

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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