Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTA75N10P-TRL

IXTA75N10P-TRL

Wickmann / Littelfuse

MOSFET N-CH 100V 75A TO263

0

IXTX90N25L2

IXTX90N25L2

Wickmann / Littelfuse

MOSFET N-CH 250V 90A PLUS247-3

2253

IXTP28P065T

IXTP28P065T

Wickmann / Littelfuse

MOSFET P-CH 65V 28A TO220AB

881550

IXTQ76N25T

IXTQ76N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 76A TO3P

5

IXTH64N65X

IXTH64N65X

Wickmann / Littelfuse

MOSFET N-CH 650V 64A TO247

0

IXTK88N30P

IXTK88N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 88A TO264

3625

IXFH46N65X2

IXFH46N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 46A TO247

26

IXTA42N25P

IXTA42N25P

Wickmann / Littelfuse

MOSFET N-CH 250V 42A TO263

1050

IXFL132N50P3

IXFL132N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 63A ISOPLUS264

250

IXFT58N20

IXFT58N20

Wickmann / Littelfuse

MOSFET N-CH 200V 58A TO268

0

IXFH16N120P

IXFH16N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 16A TO247AD

756

IXKN75N60C

IXKN75N60C

Wickmann / Littelfuse

MOSFET N-CH 600V 75A SOT-227B

0

IXTH130N10T

IXTH130N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 130A TO247

0

IXTP20N65X

IXTP20N65X

Wickmann / Littelfuse

MOSFET N-CH 650V 20A TO220

0

IXTN46N50L

IXTN46N50L

Wickmann / Littelfuse

MOSFET N-CH 500V 46A SOT-227B

0

IXTP02N120P

IXTP02N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 200MA TO220AB

5413600

CPC3982TTR

CPC3982TTR

Wickmann / Littelfuse

MOSFET N-CH 800V SOT23

1255

IXFB40N110Q3

IXFB40N110Q3

Wickmann / Littelfuse

MOSFET N-CH 1100V 40A PLUS264

14

IXTA3N50D2

IXTA3N50D2

Wickmann / Littelfuse

MOSFET N-CH 500V 3A TO263

1732300

IXFR14N100Q2

IXFR14N100Q2

Wickmann / Littelfuse

MOSFET N-CH 1000V 9.5A ISOPLS247

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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