Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTH180N10T

IXTH180N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 180A TO247

591230

IXTP60N20T

IXTP60N20T

Wickmann / Littelfuse

MOSFET N-CH 200V 60A TO220AB

100

IXTQ60N20L2

IXTQ60N20L2

Wickmann / Littelfuse

MOSFET N-CH 200V 60A TO3P

990

IXFR200N10P

IXFR200N10P

Wickmann / Littelfuse

MOSFET N-CH 100V 133A ISOPLUS247

1440

IXTA3N100D2

IXTA3N100D2

Wickmann / Littelfuse

MOSFET N-CH 1000V 3A TO263

5062

IXTQ130N10T

IXTQ130N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 130A TO3P

67

IXTQ48N20T

IXTQ48N20T

Wickmann / Littelfuse

MOSFET N-CH 200V 48A TO3P

0

IXTT16N50D2

IXTT16N50D2

Wickmann / Littelfuse

MOSFET N-CH 500V 16A TO268

2700

IXFA230N075T2-7

IXFA230N075T2-7

Wickmann / Littelfuse

MOSFET N-CH 75V 230A TO263-7

1250

IXFP34N65X2M

IXFP34N65X2M

Wickmann / Littelfuse

MOSFET N-CH 650V 34A TO220

0

IXFB44N100Q3

IXFB44N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 44A PLUS264

20

IXTA60N20T-TRL

IXTA60N20T-TRL

Wickmann / Littelfuse

MOSFET N-CH 200V 60A TO263

0

IXTH30N60P

IXTH30N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 30A TO247

768

IXFT94N30P3

IXFT94N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 94A TO268

2070

IXFX32N90P

IXFX32N90P

Wickmann / Littelfuse

MOSFET N-CH 900V 32A PLUS247-3

1110

IXTR90P20P

IXTR90P20P

Wickmann / Littelfuse

MOSFET P-CH 200V 53A ISOPLUS247

30300

IXTA36N30P

IXTA36N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 36A TO263

10

CPC3960ZTR

CPC3960ZTR

Wickmann / Littelfuse

MOSFET N-CH 600V SOT223

0

IXFN50N50

IXFN50N50

Wickmann / Littelfuse

MOSFET N-CH 500V 50A SOT-227B

0

IXTA26P20P

IXTA26P20P

Wickmann / Littelfuse

MOSFET P-CH 200V 26A TO263

1227

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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