Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
IXFA12N65X2 Wickmann / Littelfuse	MOSFET N-CH 650V 12A TO263AA	3002300
IXTA62N15P-TRL Wickmann / Littelfuse	MOSFET N-CH 150V 62A TO263	0
IXTA230N075T2-TRL Wickmann / Littelfuse	MOSFET N-CH 75V 230A TO263	1600
IXFR4N100Q Wickmann / Littelfuse	MOSFET N-CH 1000V 3.5A ISOPLS247	100
IXFH16N80P Wickmann / Littelfuse	MOSFET N-CH 800V 16A TO247AD	571
IXTA1N100P-TRL Wickmann / Littelfuse	MOSFET N-CH 1000V 1A TO263	0
CPC3909ZTR Wickmann / Littelfuse	MOSFET N-CH 400V 300MA SOT223	90
IXTQ30N60P Wickmann / Littelfuse	MOSFET N-CH 600V 30A TO3P	200450
IXTA24P085T Wickmann / Littelfuse	MOSFET P-CH 85V 24A TO263	172
IXTA28P065T Wickmann / Littelfuse	MOSFET P-CH 65V 28A TO263	0
IXTP6N50D2 Wickmann / Littelfuse	MOSFET N-CH 500V 6A TO220AB	381
IXTA14N60P Wickmann / Littelfuse	MOSFET N-CH 600V 14A TO263	4750
IXTT96N15P Wickmann / Littelfuse	MOSFET N-CH 150V 96A TO268	4020
IXKR25N80C Wickmann / Littelfuse	MOSFET N-CH 800V 25A ISOPLUS247	0
IXFH42N50P2 Wickmann / Littelfuse	MOSFET N-CH 500V 42A TO247AD	1774
IXTA4N150HV-TRL Wickmann / Littelfuse	MOSFET N-CH 1500V 4A TO263HV	800
IXTA120P065T-TRL Wickmann / Littelfuse	MOSFET P-CH 65V 120A TO263	800
IXTT2N300P3HV Wickmann / Littelfuse	MOSFET N-CH 3000V 2A TO268	0
IXTT52N30P Wickmann / Littelfuse	MOSFET N-CH 300V 52A TO268	3870
IXTT30N50L2 Wickmann / Littelfuse	MOSFET N-CH 500V 30A TO268	3690

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS