Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFN80N50P

IXFN80N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 66A SOT227B

3594

IXTA05N100HV-TRL

IXTA05N100HV-TRL

Wickmann / Littelfuse

MOSFET N-CH 1000V 750MA TO263HV

0

IXTP230N04T4

IXTP230N04T4

Wickmann / Littelfuse

MOSFET N-CH 40V 230A TO220AB

50

IXFR180N15P

IXFR180N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 100A ISOPLUS247

1410

IXFA4N100P

IXFA4N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 4A TO263

185600

IXTA75N10P

IXTA75N10P

Wickmann / Littelfuse

MOSFET N-CH 100V 75A TO263

55800

IXFQ30N60X

IXFQ30N60X

Wickmann / Littelfuse

MOSFET N-CH 600V 30A TO3P

1260

IXTA2N100P-TRL

IXTA2N100P-TRL

Wickmann / Littelfuse

MOSFET N-CH 1000V 2A TO263

0

IXFA3N120-TRR

IXFA3N120-TRR

Wickmann / Littelfuse

MOSFET N-CH 1200V 3A TO263

0

IXTA140N055T2

IXTA140N055T2

Wickmann / Littelfuse

MOSFET N-CH 55V 140A TO263

0

IXFA26N30X3

IXFA26N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 26A TO263AA

2792650

IXTK22N100L

IXTK22N100L

Wickmann / Littelfuse

MOSFET N-CH 1000V 22A TO264

330

IXTA10P50P

IXTA10P50P

Wickmann / Littelfuse

MOSFET P-CH 500V 10A TO263

4009

IXFK160N30T

IXFK160N30T

Wickmann / Littelfuse

MOSFET N-CH 300V 160A TO264AA

0

LSIC1MO170T0750

LSIC1MO170T0750

Wickmann / Littelfuse

SICFET N-CH 1700V 6.4A TO263-7L

0

IXFP18N60X

IXFP18N60X

Wickmann / Littelfuse

MOSFET N-CH 600V 18A TO220AB

1800

IXTA3N110

IXTA3N110

Wickmann / Littelfuse

MOSFET N-CH 1100V 3A TO263

0

IXTH102N15T

IXTH102N15T

Wickmann / Littelfuse

MOSFET N-CH 150V 102A TO247

360

IXFQ50N60P3

IXFQ50N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 50A TO3P

23510

IXFR64N50Q3

IXFR64N50Q3

Wickmann / Littelfuse

MOSFET N-CH 500V 45A ISOPLUS247

2040

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top