Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTA08N50D2

IXTA08N50D2

Wickmann / Littelfuse

MOSFET N-CH 500V 800MA TO263

1342950

IXTQ14N60P

IXTQ14N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 14A TO3P

0

IXTX32P60P

IXTX32P60P

Wickmann / Littelfuse

MOSFET P-CH 600V 32A PLUS247-3

750

IXFH120N25T

IXFH120N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 120A TO247AD

930

IXFH72N30X3

IXFH72N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 72A TO247

0

IXTH1N200P3HV

IXTH1N200P3HV

Wickmann / Littelfuse

MOSFET N-CH 2000V 1A TO247HV

0

IXFY8N65X2

IXFY8N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 8A TO252AA

0

IXFH70N20Q3

IXFH70N20Q3

Wickmann / Littelfuse

MOSFET N-CH 200V 70A TO247AD

29

IXTA36N30P-TRL

IXTA36N30P-TRL

Wickmann / Littelfuse

MOSFET N-CH 300V 36A TO263

0

IXKP24N60C5

IXKP24N60C5

Wickmann / Littelfuse

MOSFET N-CH 600V 24A TO220AB

0

IXTP50N25T

IXTP50N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 50A TO220AB

73

IXTH4N150

IXTH4N150

Wickmann / Littelfuse

MOSFET N-CH 1500V 4A TO247

0

IXFH20N85X

IXFH20N85X

Wickmann / Littelfuse

MOSFET N-CH 850V 20A TO247

41

IXFN64N60P

IXFN64N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 50A SOT227B

9

IXFN62N80Q3

IXFN62N80Q3

Wickmann / Littelfuse

MOSFET N-CH 800V 49A SOT227B

0

IXFT50N60P3

IXFT50N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 50A TO268

291660

IXTT3N200P3HV

IXTT3N200P3HV

Wickmann / Littelfuse

MOSFET N-CH 2000V 3A TO268

930

IXFN38N80Q2

IXFN38N80Q2

Wickmann / Littelfuse

MOSFET N-CH 800V 38A SOT227B

0

IXTK150N15P

IXTK150N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 150A TO264

2800

IXFZ140N25T

IXFZ140N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 100A DE475

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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