Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFN210N30X3

IXFN210N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 210A SOT227B

212

IXTY26P10T

IXTY26P10T

Wickmann / Littelfuse

MOSFET P-CH 100V 26A TO252

560

IXTA08N120P-TRL

IXTA08N120P-TRL

Wickmann / Littelfuse

MOSFET N-CH 1200V 800MA TO263

0

IXFP72N20X3

IXFP72N20X3

Wickmann / Littelfuse

MOSFET N-CH 200V 72A TO220

981500

IXFH69N30P

IXFH69N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 69A TO247AD

20

IXFA14N85XHV

IXFA14N85XHV

Wickmann / Littelfuse

MOSFET N-CH 850V 14A TO263

650

CPC3701CTR

CPC3701CTR

Wickmann / Littelfuse

MOSFET N-CH 60V SOT89

831

IXFK64N60Q3

IXFK64N60Q3

Wickmann / Littelfuse

MOSFET N-CH 600V 64A TO264AA

503450

IXTH26N60P

IXTH26N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 26A TO247

0

IXFT20N100P

IXFT20N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 20A TO268

0

IXFB50N80Q2

IXFB50N80Q2

Wickmann / Littelfuse

MOSFET N-CH 800V 50A PLUS264

0

IXFH20N100P

IXFH20N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 20A TO247AD

2831110

IXTT16N10D2

IXTT16N10D2

Wickmann / Littelfuse

MOSFET N-CH 100V 16A TO268

0

IXFQ24N60X

IXFQ24N60X

Wickmann / Littelfuse

MOSFET N-CH 600V 24A TO3P

1200

IXFP20N50P3

IXFP20N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 8A TO220AB

0

IXFH120N25X3

IXFH120N25X3

Wickmann / Littelfuse

MOSFET N-CH 250V 120A TO247

30750

IXFN26N120P

IXFN26N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 23A SOT-227B

3010

IXTA48P05T

IXTA48P05T

Wickmann / Littelfuse

MOSFET P-CH 50V 48A TO263

1200

IXFH120N20P

IXFH120N20P

Wickmann / Littelfuse

MOSFET N-CH 200V 120A TO247AD

15

IXTA1R4N100P

IXTA1R4N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 1.4A TO263

1500

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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