Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFH13N90

IXFH13N90

Wickmann / Littelfuse

MOSFET N-CH 900V 13A TO247AD

0

IXTU01N100D

IXTU01N100D

Wickmann / Littelfuse

MOSFET N-CH 1000V 100MA TO251

0

IXTP8N65X2

IXTP8N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 8A TO220

4200

IXTH260N055T2

IXTH260N055T2

Wickmann / Littelfuse

MOSFET N-CH 55V 260A TO247

551050

IXTX90P20P

IXTX90P20P

Wickmann / Littelfuse

MOSFET P-CH 200V 90A PLUS247-3

176

IXFX170N20P

IXFX170N20P

Wickmann / Littelfuse

MOSFET N-CH 200V 170A PLUS247-3

870

IXTQ36N30P

IXTQ36N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 36A TO3P

238690

IXTH02N450HV

IXTH02N450HV

Wickmann / Littelfuse

MOSFET N-CH 4500V 200MA TO247HV

330

IXTP20N65X2

IXTP20N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 20A TO220AB

62250

IXTP300N04T2

IXTP300N04T2

Wickmann / Littelfuse

MOSFET N-CH 40V 300A TO220AB

0

IXFN80N60P3

IXFN80N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 66A SOT-227B

0

IXTA3N110-TRL

IXTA3N110-TRL

Wickmann / Littelfuse

MOSFET N-CH 1100V 3A TO263

0

IXFA20N85XHV-TRL

IXFA20N85XHV-TRL

Wickmann / Littelfuse

MOSFET N-CH 850V 20A TO263HV

0

IXFN50N120SIC

IXFN50N120SIC

Wickmann / Littelfuse

SICFET N-CH 1200V 47A SOT227B

0

IXTH6N100D2

IXTH6N100D2

Wickmann / Littelfuse

MOSFET N-CH 1000V 6A TO247

276

IXTY1R4N120PHV

IXTY1R4N120PHV

Wickmann / Littelfuse

MOSFET N-CH 1200V 1.4A TO252

0

IXFP7N100P

IXFP7N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 7A TO220AB

0

IXFT24N50Q

IXFT24N50Q

Wickmann / Littelfuse

MOSFET N-CH 500V 24A TO268

0

IXFH110N15T2

IXFH110N15T2

Wickmann / Littelfuse

MOSFET N-CH 150V 110A TO247AD

0

IXTN22N100L

IXTN22N100L

Wickmann / Littelfuse

MOSFET N-CH 1000V 22A SOT227B

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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