Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PSMN027-100XS,127

PSMN027-100XS,127

NXP Semiconductors

MOSFET N-CH 100V 23.4A TO220F

0

PSMN3R5-80PS

PSMN3R5-80PS

NXP Semiconductors

NOW NEXPERIA PSMN3R5-80PS - POWE

0

BUK6240-75C,118

BUK6240-75C,118

NXP Semiconductors

MOSFET N-CH 75V 22A DPAK

7500

BUK7Y22-100E115

BUK7Y22-100E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMN45EN,135

PMN45EN,135

NXP Semiconductors

MOSFET N-CH 30V 5.2A 6TSOP

450515

BUK7514-60E,127

BUK7514-60E,127

NXP Semiconductors

MOSFET N-CH 60V 58A TO220AB

0

PMZB150UNE315

PMZB150UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

BUK661R8-30C,118

BUK661R8-30C,118

NXP Semiconductors

MOSFET N-CH 30V 120A D2PAK

1473

PSMN3R2-25YLC,115

PSMN3R2-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 100A LFPAK56

3899

BUK953R5-60E,127

BUK953R5-60E,127

NXP Semiconductors

MOSFET N-CH 60V 120A TO220AB

2400

BUK9615-100E,118

BUK9615-100E,118

NXP Semiconductors

MOSFET N-CH 100V 66A D2PAK

1095

PSMN050-80BS,118

PSMN050-80BS,118

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 2

3200

PMN23UN,135

PMN23UN,135

NXP Semiconductors

MOSFET N-CH 20V 6.3A 6TSOP

11649

BUK761R6-40E,118

BUK761R6-40E,118

NXP Semiconductors

MOSFET N-CH 40V 120A D2PAK

5154

BUK7Y25-40B/C,115

BUK7Y25-40B/C,115

NXP Semiconductors

MOSFET N-CH 40V 35.3A LFPAK56

0

PMF780SN,115

PMF780SN,115

NXP Semiconductors

MOSFET N-CH 60V 570MA SOT323-3

120000

PSMN2R5-60PL127

PSMN2R5-60PL127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK95150-55A,127

BUK95150-55A,127

NXP Semiconductors

PFET, 13A I(D), 55V, 0.161OHM, 1

5722

BUK625R0-40C,118

BUK625R0-40C,118

NXP Semiconductors

PFET, 90A I(D), 40V, 0.0083OHM,

0

PMZ600UNE315

PMZ600UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

913667

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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