Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMV65XPEA215

PMV65XPEA215

NXP Semiconductors

P-CHANNEL MOSFET

885000

PMCM650VNE023

PMCM650VNE023

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

BUK653R4-40C,127

BUK653R4-40C,127

NXP Semiconductors

MOSFET N-CH 40V 100A TO220AB

4809

BUK753R5-60E,127

BUK753R5-60E,127

NXP Semiconductors

MOSFET N-CH 60V 120A TO220AB

0

BUK9880-55/CU135

BUK9880-55/CU135

NXP Semiconductors

N-CHANNEL POWER MOSFET

99000

BUK7Y21-40E115

BUK7Y21-40E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PML260SN,118

PML260SN,118

NXP Semiconductors

MOSFET N-CH 200V 8.8A DFN3333-8

0

BUK9E4R9-60E,127

BUK9E4R9-60E,127

NXP Semiconductors

MOSFET N-CH 60V 100A I2PAK

0

PMV65UN,215

PMV65UN,215

NXP Semiconductors

MOSFET N-CH 20V 2.2A TO236AB

45184

BUK9E2R3-40E,127

BUK9E2R3-40E,127

NXP Semiconductors

MOSFET N-CH 40V 120A I2PAK

300

NX7002AKA215

NX7002AKA215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

273000

PMV185XN,215

PMV185XN,215

NXP Semiconductors

MOSFET N-CH 30V 1.1A TO236AB

268400

BUK7E4R0-80E,127

BUK7E4R0-80E,127

NXP Semiconductors

MOSFET N-CH 80V 120A I2PAK

296

PMCPB5530X

PMCPB5530X

NXP Semiconductors

NOW NEXPERIA PMCPB5530X - SMALL

0

PMGD175XNE115

PMGD175XNE115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PHB18NQ10T,118

PHB18NQ10T,118

NXP Semiconductors

MOSFET N-CH 100V 18A D2PAK

1966

PSMN5R8-30LL,115

PSMN5R8-30LL,115

NXP Semiconductors

MOSFET N-CH 30V 40A 8DFN

0

PHP30NQ15T,127

PHP30NQ15T,127

NXP Semiconductors

MOSFET N-CH 150V 29A TO220AB

4980

PSMN1R9-25YLC,115

PSMN1R9-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 100A LFPAK56

7336

PSMN5R6-100XS

PSMN5R6-100XS

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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