Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK6C2R1-55C,118

BUK6C2R1-55C,118

NXP Semiconductors

MOSFET N-CH 55V 228A D2PAK

0

PMG45UN,115

PMG45UN,115

NXP Semiconductors

MOSFET N-CH 20V 3A 6TSSOP

9000

PMZB390UNE315

PMZB390UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

639915

PSMN2R0-60ES,127

PSMN2R0-60ES,127

NXP Semiconductors

ELEMENT, NCHANNEL, SILICON, MOSF

8890

BUK78150-55A/CU135

BUK78150-55A/CU135

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PHT6N06T,135

PHT6N06T,135

NXP Semiconductors

MOSFET N-CH 55V 5.5A SC73

23747

PMN80XP,115

PMN80XP,115

NXP Semiconductors

MOSFET P-CH 20V 2.5A 6TSOP

0

PHK31NQ03LT,518

PHK31NQ03LT,518

NXP Semiconductors

MOSFET N-CH 30V 30.4A 8SO

0

BUK9E8R5-40E,127

BUK9E8R5-40E,127

NXP Semiconductors

MOSFET N-CH 40V 75A I2PAK

0

BUK9C10-55BIT/A,11

BUK9C10-55BIT/A,11

NXP Semiconductors

MOSFET N-CH 55V 75A D2PAK-7

1840

BUK9609-55A,118

BUK9609-55A,118

NXP Semiconductors

MOSFET N-CH 55V 75A D2PAK

1600

PMV65XP/MI215

PMV65XP/MI215

NXP Semiconductors

P-CHANNEL MOSFET

6000

BUK761R8-30C,118

BUK761R8-30C,118

NXP Semiconductors

MOSFET N-CH 30V 100A D2PAK

839

BUK9840-55/CUX

BUK9840-55/CUX

NXP Semiconductors

MOSFET N-CH 55V 5A/10.7A SOT223

0

BUK652R6-40C,127

BUK652R6-40C,127

NXP Semiconductors

MOSFET N-CH 40V 120A TO220AB

3041

BUK751R8-40E127

BUK751R8-40E127

NXP Semiconductors

N-CHANNEL POWER MOSFET

784

BUK7606-55A,118

BUK7606-55A,118

NXP Semiconductors

MOSFET N-CH 55V 75A D2PAK

800

BUK6507-55C,127

BUK6507-55C,127

NXP Semiconductors

PFET, 100A I(D), 55V, 0.0105OHM,

4728

PMZB300XN,315

PMZB300XN,315

NXP Semiconductors

MOSFET N-CH 20V 1A DFN1006B-3

248800

PMN15UN115

PMN15UN115

NXP Semiconductors

SMALL SIGNAL FET

9000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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