Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BSH205,215

BSH205,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

330478

BUK9E1R6-30E,127

BUK9E1R6-30E,127

NXP Semiconductors

MOSFET N-CH 30V 120A I2PAK

0

PMCM4401VPE084

PMCM4401VPE084

NXP Semiconductors

PMCM4401 SMALL SIGNAL FET

279000

PSMN085-150K,518

PSMN085-150K,518

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 3

0

BUK7508-55A,127

BUK7508-55A,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

0

PMN30UN115

PMN30UN115

NXP Semiconductors

N-CHANNEL, MOSFET

597000

PMPB12UN,115

PMPB12UN,115

NXP Semiconductors

MOSFET N-CH 20V 7.9A 6DFN

68963

BSH205G2215

BSH205G2215

NXP Semiconductors

P-CHANNEL MOSFET

0

PMPB85ENEA115

PMPB85ENEA115

NXP Semiconductors

N-CHANNEL POWER MOSFET

18000

PMV20XNE215

PMV20XNE215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

217500

BUK662R7-55C,118

BUK662R7-55C,118

NXP Semiconductors

PFET, 120A I(D), 55V, 0.0044OHM,

10309

PMZ370UNE315

PMZ370UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PMF3800SN,115

PMF3800SN,115

NXP Semiconductors

MOSFET N-CH 60V 260MA SC70

1895250

PSMN9R0-25YLC,115

PSMN9R0-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 46A LFPAK56

9204

BUK761R4-30E,118

BUK761R4-30E,118

NXP Semiconductors

MOSFET N-CH 30V 120A D2PAK

5055

PSMN2R6-60PS127

PSMN2R6-60PS127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK724R5-30C118

BUK724R5-30C118

NXP Semiconductors

N-CHANNEL POWER MOSFET

9878

PSMN3R7-25YLC,115

PSMN3R7-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 97A LFPAK56

7192

BUK7506-75B,127

BUK7506-75B,127

NXP Semiconductors

PFET, 75A I(D), 75V, 0.0056OHM,

1300

PMZB420UN

PMZB420UN

NXP Semiconductors

SMALL SIGNAL FET

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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