Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK9E04-30B,127

BUK9E04-30B,127

NXP Semiconductors

PFET, 75A I(D), 30V, 0.0044OHM,

811

BUK9E3R2-40E,127

BUK9E3R2-40E,127

NXP Semiconductors

MOSFET N-CH 40V 100A I2PAK

0

PMZ390UNE/S500315

PMZ390UNE/S500315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

100000

BUK9510-55A,127

BUK9510-55A,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

2000

PMV90ENE215

PMV90ENE215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

60000

PMV60EN,215

PMV60EN,215

NXP Semiconductors

MOSFET N-CH 30V 4.7A TO236AB

52475

BUK652R3-40C,127

BUK652R3-40C,127

NXP Semiconductors

MOSFET N-CH 40V 120A TO220AB

5171

BUK9515-60E,127

BUK9515-60E,127

NXP Semiconductors

MOSFET N-CH 60V 54A TO220AB

0

PHK12NQ03LT,518

PHK12NQ03LT,518

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 1

0

BUK9107-40ATC,118

BUK9107-40ATC,118

NXP Semiconductors

BUK9107-40ATC - D2PAK

0

BUK7613-75B,118

BUK7613-75B,118

NXP Semiconductors

MOSFET N-CH 75V 75A D2PAK

2481

BUK7108-40AIE,118

BUK7108-40AIE,118

NXP Semiconductors

PFET, 75A I(D), 40V, 0.008OHM, 1

1115

2N7002PS/ZL115

2N7002PS/ZL115

NXP Semiconductors

N-CHANNEL SMALL SIGNAL MOSFET

306000

BUK7619-100B,118

BUK7619-100B,118

NXP Semiconductors

MOSFET N-CH 100V 64A D2PAK

667

BUK7107-55AIE,118

BUK7107-55AIE,118

NXP Semiconductors

MOSFET N-CH 55V 75A SOT426

0

NX7002BKMB315

NX7002BKMB315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

30000

BUK9245-55A/C1118

BUK9245-55A/C1118

NXP Semiconductors

N-CHANNEL POWER MOSFET

15000

BUK7506-55A,127

BUK7506-55A,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

1435

BSH111BK215

BSH111BK215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PH3330L,115

PH3330L,115

NXP Semiconductors

MOSFET N-CH 30V 100A LFPAK56

1532

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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