Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMV30XN,215

PMV30XN,215

NXP Semiconductors

MOSFET N-CH 20V 3.2A TO236AB

236528

PSMN4R6-100XS,127

PSMN4R6-100XS,127

NXP Semiconductors

MOSFET N-CH 100V 70.4A TO220F

981

BUK7628-100A,118

BUK7628-100A,118

NXP Semiconductors

MOSFET N-CH 100V 47A D2PAK

4000

BUK7E11-55B,127

BUK7E11-55B,127

NXP Semiconductors

MOSFET N-CH 55V 75A I2PAK

990

PMZB600UNE315

PMZB600UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

599486

BUK9516-75B,127

BUK9516-75B,127

NXP Semiconductors

PFET, 67A I(D), 75V, 0.018OHM, 1

684

BUK7575-55A,127

BUK7575-55A,127

NXP Semiconductors

MOSFET N-CH 55V 20.3A TO220AB

0

PMV32UP/MI215

PMV32UP/MI215

NXP Semiconductors

P-CHANNEL MOSFET

6000

PMV48XPA215

PMV48XPA215

NXP Semiconductors

P-CHANNEL MOSFET

7084

PH2625L,115

PH2625L,115

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 1

30821

PSMN3R3-80ES,127

PSMN3R3-80ES,127

NXP Semiconductors

ELEMENT, NCHANNEL, SILICON, MOSF

1415

BUK752R3-40E,127

BUK752R3-40E,127

NXP Semiconductors

MOSFET N-CH 40V 120A TO220AB

0

PSMN165-200K518

PSMN165-200K518

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

BUK7Y20-30B,115

BUK7Y20-30B,115

NXP Semiconductors

MOSFET N-CH 30V 39.5A LFPAK56

10500

BUK962R1-40E,118

BUK962R1-40E,118

NXP Semiconductors

MOSFET N-CH 40V 120A D2PAK

3369

PMZ290UNEYL

PMZ290UNEYL

NXP Semiconductors

EFFECT TRANSISTOR, 1.2A I(D), 20

1609000

PMZB420UN,315

PMZB420UN,315

NXP Semiconductors

MOSFET N-CH 30V 900MA DFN1006B-3

116752

NX3008PBKT,115

NX3008PBKT,115

NXP Semiconductors

MOSFET P-CH 30V 200MA SC75

0

PMV22EN,215

PMV22EN,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

994810

BUK9511-55A,127

BUK9511-55A,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

2002

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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