Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMF63UN,115

PMF63UN,115

NXP Semiconductors

NOW NEXPERIA PMF63UN - SC-70

83833

BUK752R7-60E,127

BUK752R7-60E,127

NXP Semiconductors

MOSFET N-CH 60V 120A TO220AB

1053

BUK95180-100A,127

BUK95180-100A,127

NXP Semiconductors

MOSFET N-CH 100V 11A TO220AB

2936

BUK653R2-55C,127

BUK653R2-55C,127

NXP Semiconductors

PFET, 120A I(D), 55V, 0.0048OHM,

3726

PSMN8R040PS127

PSMN8R040PS127

NXP Semiconductors

MOSFET N-CH 40V 77A TO220AB

0

BUK7Y25-80E/GF115

BUK7Y25-80E/GF115

NXP Semiconductors

N-CHANNEL POWER MOSFET

21000

PMN49EN,135

PMN49EN,135

NXP Semiconductors

MOSFET N-CH 30V 4.6A 6TSOP

58959

BUK9E4R4-40B,127

BUK9E4R4-40B,127

NXP Semiconductors

MOSFET N-CH 40V 75A I2PAK

990

PSMN070-200P,127

PSMN070-200P,127

NXP Semiconductors

MOSFET N-CH 200V 35A TO220AB

0

BUK962R6-40E,118

BUK962R6-40E,118

NXP Semiconductors

MOSFET N-CH 40V 100A D2PAK

640

BUK764R2-80E,118

BUK764R2-80E,118

NXP Semiconductors

MOSFET N-CH 80V 120A D2PAK

338

PMV130ENEA/DG/B2215

PMV130ENEA/DG/B2215

NXP Semiconductors

PMV130ENEA SMALL SIGNAL FET

21000

BUK764R3-40B,118

BUK764R3-40B,118

NXP Semiconductors

MOSFET N-CH 40V 75A D2PAK

7615

BSP100,135

BSP100,135

NXP Semiconductors

MOSFET N-CH 30V 3.2A SOT223

0

BUK752R3-40C,127

BUK752R3-40C,127

NXP Semiconductors

PFET, 100A I(D), 40V, 0.0023OHM,

1183

PHK5NQ15T518

PHK5NQ15T518

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

7096

BUK7E07-55B,127

BUK7E07-55B,127

NXP Semiconductors

MOSFET N-CH 55V 75A I2PAK

844

PMV25ENEA215

PMV25ENEA215

NXP Semiconductors

PMV25E SMALL SIGNAL FET, SOT23

288000

PMN38EN,135

PMN38EN,135

NXP Semiconductors

MOSFET N-CH 30V 5.4A 6TSOP

60300

PMF290XN,115

PMF290XN,115

NXP Semiconductors

MOSFET N-CH 20V 1A SOT323-3

45897

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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