Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK954R4-40B127

BUK954R4-40B127

NXP Semiconductors

N-CHANNEL POWER MOSFET

2000

BUK9515-100A127

BUK9515-100A127

NXP Semiconductors

N-CHANNEL POWER MOSFET

8000

PMK30EP518

PMK30EP518

NXP Semiconductors

P-CHANNEL POWER MOSFET

1521

BUK754R0-40C,127

BUK754R0-40C,127

NXP Semiconductors

MOSFET N-CH 40V 100A TO220AB

989

BUK9E3R2-40B,127

BUK9E3R2-40B,127

NXP Semiconductors

MOSFET N-CH 40V 100A I2PAK

300

BSH205G2235

BSH205G2235

NXP Semiconductors

P-CHANNEL MOSFET

20000

BUK7Y25-40B,115

BUK7Y25-40B,115

NXP Semiconductors

TRANSISTOR >30MHZ

2537

PMV280ENEA215

PMV280ENEA215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

15000

BUK7Y43-60E115

BUK7Y43-60E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

7500

PMV250EPEA215

PMV250EPEA215

NXP Semiconductors

P-CHANNEL MOSFET

141000

PSMN9R0-30YL,115

PSMN9R0-30YL,115

NXP Semiconductors

MOSFET N-CH 30V 61A LFPAK56

19979

PMDPB30XN/S711115

PMDPB30XN/S711115

NXP Semiconductors

PMDPB30XN SMALL SIGNAL FET

21000

PSMN4R3-100ES,127

PSMN4R3-100ES,127

NXP Semiconductors

TRANSISTOR >30MHZ

0

BUK7511-55B,127

BUK7511-55B,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

2208

PMT29EN,115

PMT29EN,115

NXP Semiconductors

MOSFET N-CH 30V 6A SOT223

0

NXS7002AK215

NXS7002AK215

NXP Semiconductors

SMALL SIGNAL FET

8613000

BUK9875-100A/C1115

BUK9875-100A/C1115

NXP Semiconductors

N-CHANNEL POWER MOSFET

9000

BUK754R3-75C,127

BUK754R3-75C,127

NXP Semiconductors

MOSFET N-CH 75V 100A TO220AB

4929

BUK7Y21-40E

BUK7Y21-40E

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK754R0-55B,127

BUK754R0-55B,127

NXP Semiconductors

PFET, 75A I(D), 55V, 0.004OHM, 1

1560

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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