Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMN70XP115

PMN70XP115

NXP Semiconductors

P-CHANNEL MOSFET

597000

PMN25EN,115

PMN25EN,115

NXP Semiconductors

MOSFET N-CH 30V 6.2A 6TSOP

6000

PMN25UN,115

PMN25UN,115

NXP Semiconductors

MOSFET N-CH 20V 6A 6TSOP

19555

BUK9107-55ATE,118

BUK9107-55ATE,118

NXP Semiconductors

NOW NEXPERIA BUK9107-55ATE -

2600

PMN48XPA115

PMN48XPA115

NXP Semiconductors

P-CHANNEL MOSFET

0

ON5257215

ON5257215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

96000

BUK6209-30C,118

BUK6209-30C,118

NXP Semiconductors

MOSFET N-CH 30V 50A DPAK

9725

BUK9230-55A/C1118

BUK9230-55A/C1118

NXP Semiconductors

N-CHANNEL POWER MOSFET

31793

PMN20EN,115

PMN20EN,115

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

20000

BUK6E2R0-30C127

BUK6E2R0-30C127

NXP Semiconductors

N-CHANNEL POWER MOSFET

4728

PMN40UPE,115

PMN40UPE,115

NXP Semiconductors

MOSFET P-CH 20V 4.7A 6TSOP

0

PSMN8R5-108ES

PSMN8R5-108ES

NXP Semiconductors

N-CHANNEL POWER MOSFET

466

BUK7E13-60E,127

BUK7E13-60E,127

NXP Semiconductors

MOSFET N-CH 60V 58A I2PAK

1470

PMZB790SN,315

PMZB790SN,315

NXP Semiconductors

MOSFET N-CH 60V 650MA DFN1006B-3

178722

PMF250XNE115

PMF250XNE115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

90000

NX138BK215

NX138BK215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

BUK652R0-30C,127

BUK652R0-30C,127

NXP Semiconductors

MOSFET N-CH 30V 120A TO220AB

3183

PMR290XN,115

PMR290XN,115

NXP Semiconductors

MOSFET N-CH 20V 970MA SC75

69150

PSMN8R0-30YLC115

PSMN8R0-30YLC115

NXP Semiconductors

N-CHANNEL POWER MOSFET

2776

PMPB16XN,115

PMPB16XN,115

NXP Semiconductors

MOSFET N-CH 30V 7.2A 6DFN

114000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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