Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK762R0-40C,118

BUK762R0-40C,118

NXP Semiconductors

PFET, 276A I(D), 40V, 0.00375OHM

8697

BUK653R5-55C,127

BUK653R5-55C,127

NXP Semiconductors

PFET, 120A I(D), 55V, 0.0055OHM,

4931

BUK956R1-100E,127

BUK956R1-100E,127

NXP Semiconductors

MOSFET N-CH 100V 120A TO220AB

1025

BUK7506-55B,127

BUK7506-55B,127

NXP Semiconductors

MOSFET N-CH 55V 75A TO220AB

333

PSMN8R5-100PS127

PSMN8R5-100PS127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PSMN012-25YLC,115

PSMN012-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 33A LFPAK56

4847

BUK7523-75A,127

BUK7523-75A,127

NXP Semiconductors

MOSFET N-CH 75V 53A TO220AB

0

BUK9E08-55B,127-NXP

BUK9E08-55B,127-NXP

NXP Semiconductors

PFET, 75A I(D), 55V, 0.0093OHM,

0

PMV28UNEA215

PMV28UNEA215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PMV56XN,215

PMV56XN,215

NXP Semiconductors

MOSFET N-CH 20V 3.76A TO236AB

86150

BUK953R2-40E,127

BUK953R2-40E,127

NXP Semiconductors

MOSFET N-CH 40V 100A TO220AB

0

BUK7514-55A,127

BUK7514-55A,127

NXP Semiconductors

PFET, 73A I(D), 55V, 0.014OHM, 1

7599

2N7002BKV/DG/B2115

2N7002BKV/DG/B2115

NXP Semiconductors

N-CHANNEL SMALL SIGNAL MOSFET

68000

BUK7Y15-100E115

BUK7Y15-100E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMV30UN,215

PMV30UN,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

34302

PMV40UN,215

PMV40UN,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

158211

BUK6213-30A,118

BUK6213-30A,118

NXP Semiconductors

TRANSISTOR >30MHZ

4990

PMFPB8040XP,115

PMFPB8040XP,115

NXP Semiconductors

MOSFET P-CH 20V 2.7A HUSON6

161589

BUK655R0-75C,127

BUK655R0-75C,127

NXP Semiconductors

MOSFET N-CH 75V 120A TO220AB

0

PSMN8R5-100XSQ

PSMN8R5-100XSQ

NXP Semiconductors

MOSFET N-CH 100V 49A TO220F

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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