Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK9523-75A,127

BUK9523-75A,127

NXP Semiconductors

MOSFET N-CH 75V 53A TO220AB

5307

PMV62XN215

PMV62XN215

NXP Semiconductors

SMALL SIGNAL FET

9000

BUK6215-75C,118

BUK6215-75C,118

NXP Semiconductors

MOSFET N-CH 75V 57A DPAK

0

PMV45EN2215

PMV45EN2215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PMZ200UNE315

PMZ200UNE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

393867

PSMN2R8-40BS,118

PSMN2R8-40BS,118

NXP Semiconductors

MOSFET N-CH 40V 100A D2PAK

11667

SI2302DS,215

SI2302DS,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

57446

PSMN7R8-120ESQ

PSMN7R8-120ESQ

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 7

430

BUK96180-100A,118

BUK96180-100A,118

NXP Semiconductors

MOSFET N-CH 100V 11A D2PAK

15000

BUK7Y25-40B/C3115

BUK7Y25-40B/C3115

NXP Semiconductors

N-CHANNEL POWER MOSFET

10500

PMN52XP115

PMN52XP115

NXP Semiconductors

P-CHANNEL MOSFET

636000

PSMN010-25YLC,115

PSMN010-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 39A LFPAK56

4030

BUK7531R-40E127

BUK7531R-40E127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMG370XN,115

PMG370XN,115

NXP Semiconductors

MOSFET N-CH 30V 960MA 6TSSOP

111000

BUK9E08-55B,127

BUK9E08-55B,127

NXP Semiconductors

PFET, 75A I(D), 55V, 0.0093OHM,

0

NX3008NBKV/S500115

NX3008NBKV/S500115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

16000

BUK7507-55B,127

BUK7507-55B,127

NXP Semiconductors

PFET, 119A I(D), 55V, 0.0071OHM,

3998

PH6530AL115

PH6530AL115

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR

4500

PSMN5R0-100XS,127

PSMN5R0-100XS,127

NXP Semiconductors

MOSFET N-CH 100V 67.5A TO220F

0

PMZB290UNE,315

PMZB290UNE,315

NXP Semiconductors

MOSFET N-CH 20V 1A DFN1006B-3

1261575

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top