Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PSMN017-30LL,115

PSMN017-30LL,115

NXP Semiconductors

MOSFET N-CH 30V 15A 8DFN

1309

PSMN035-150P,127

PSMN035-150P,127

NXP Semiconductors

MOSFET N-CH 150V 50A TO220AB

0

PHT6N06LT,135

PHT6N06LT,135

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 2

427066

BUK7620-100A,118

BUK7620-100A,118

NXP Semiconductors

TRANSISTOR >30MHZ

16759

BUK961R7-40E,118

BUK961R7-40E,118

NXP Semiconductors

MOSFET N-CH 40V 120A D2PAK

350

PHB66NQ03LT

PHB66NQ03LT

NXP Semiconductors

NOW NEXPERIA 66A, 25V, 0.0136OHM

0

BUK98150-55135

BUK98150-55135

NXP Semiconductors

N-CHANNEL POWER MOSFET

50980

SI4410DY,518

SI4410DY,518

NXP Semiconductors

MOSFET N-CH 30V 8SO

12882

BUK9509-75A,127

BUK9509-75A,127

NXP Semiconductors

MOSFET N-CH 75V 75A TO220AB

4084

PHD108NQ03LT,118

PHD108NQ03LT,118

NXP Semiconductors

MOSFET N-CH 25V 75A DPAK

1190

BUK6E2R3-40C,127

BUK6E2R3-40C,127

NXP Semiconductors

MOSFET N-CH 40V 120A I2PAK

0

PMV48XP/MI215

PMV48XP/MI215

NXP Semiconductors

P-CHANNEL MOSFET

192000

BUK7504-40A,127

BUK7504-40A,127

NXP Semiconductors

MOSFET N-CH 40V 75A TO220AB

1000

PSMN1R7-25YLC,115

PSMN1R7-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 100A LFPAK56

3133

BUK951R9-40E,127

BUK951R9-40E,127

NXP Semiconductors

MOSFET N-CH 40V 120A TO220AB

0

PMV31XN,215

PMV31XN,215

NXP Semiconductors

MOSFET N-CH 20V 5.9A TO236AB

20118

PMR780SN115

PMR780SN115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

3000

BUK9505-30A,127

BUK9505-30A,127

NXP Semiconductors

MOSFET N-CH 30V 75A TO220AB

4012

BUK9E15-60E,127

BUK9E15-60E,127

NXP Semiconductors

MOSFET N-CH 60V 54A I2PAK

0

PMN35EN,115

PMN35EN,115

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

211087

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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