Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK769R6-80E,118

BUK769R6-80E,118

NXP Semiconductors

MOSFET N-CH 80V 75A D2PAK

4800

PH1225AL,115

PH1225AL,115

NXP Semiconductors

MOSFET N-CH 25V 100A LFPAK56

0

BUK7230-55A/C1118

BUK7230-55A/C1118

NXP Semiconductors

N-CHANNEL POWER MOSFET

15000

PMV170UN,215

PMV170UN,215

NXP Semiconductors

MOSFET N-CH 20V 1A TO236AB

36000

BUK7631-100E,118

BUK7631-100E,118

NXP Semiconductors

MOSFET N-CH 100V 34A D2PAK

2251

PMDPB70XPE

PMDPB70XPE

NXP Semiconductors

NOW NEXPERIA PMDPB70XPE - SMALL

0

PSMN7R5-25YLC,115

PSMN7R5-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 56A LFPAK56

7362

BUK754R7-60E,127

BUK754R7-60E,127

NXP Semiconductors

MOSFET N-CH 60V 100A TO220AB

1957

BUK7908-40AIE127

BUK7908-40AIE127

NXP Semiconductors

N-CHANNEL POWER MOSFET

2868

BUK6E3R2-55C,127

BUK6E3R2-55C,127

NXP Semiconductors

MOSFET N-CH 55V 120A I2PAK

0

BUK7Y7R6-40E/C4115

BUK7Y7R6-40E/C4115

NXP Semiconductors

N-CHANNEL POWER MOSFET

3000

BUK7510-100B,127

BUK7510-100B,127

NXP Semiconductors

PFET, 75A I(D), 100V, 0.01OHM, 1

1139

PSMN8R0-30LYC115

PSMN8R0-30LYC115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BSS138BKW-B115

BSS138BKW-B115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

NX7002BK215

NX7002BK215

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

1339000

BUK6510-75C,127

BUK6510-75C,127

NXP Semiconductors

MOSFET N-CH 75V 77A TO220AB

4291

BUK9529-100B/C127

BUK9529-100B/C127

NXP Semiconductors

N-CHANNEL POWER MOSFET

37576

BUK7Y4R4-40E115

BUK7Y4R4-40E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

1500

BUK652R1-30C,127

BUK652R1-30C,127

NXP Semiconductors

PFET, 120A I(D), 30V, 0.0035OHM,

5004

BUK7507-30B,127

BUK7507-30B,127

NXP Semiconductors

PFET, 75A I(D), 30V, 0.007OHM, 1

4611

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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