Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SSM3K357R,LF

SSM3K357R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 650MA SOT23F

3198

TK31N60W5,S1VF

TK31N60W5,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO247

29

TK100A08N1,S4X

TK100A08N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 100A TO220SIS

2

TK3A60DA(Q,M)

TK3A60DA(Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 2.5A TO220SIS

39

TPH5R906NH,L1Q

TPH5R906NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 28A 8SOP

4978

TK290A65Y,S4X

TK290A65Y,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 11.5A TO220SIS

100

SSM3K09FU,LF

SSM3K09FU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 400MA USM

26087

TK40S10K3Z(T6L1,NQ

TK40S10K3Z(T6L1,NQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 40A DPAK

0

TK31E60X,S1X

TK31E60X,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO220

0

TPH4R50ANH,L1Q

TPH4R50ANH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 100V 60A SOP ADV

4699

SSM3J35AFS,LF

SSM3J35AFS,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 250MA SSM

8330

TK90S06N1L,LXHQ

TK90S06N1L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 90A DPAK

3335

SSM6J216FE,LF

SSM6J216FE,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CHANNEL 12V 4.8A ES6

6852

SSM6K217FE,LF

SSM6K217FE,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 1.8A ES6

39485

TK6A60D(STA4,Q,M)

TK6A60D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 6A TO220SIS

1797

TPH12008NH,L1Q

TPH12008NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 24A 8SOP

0

SSM3J15FU,LF

SSM3J15FU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 100MA USM

4

SSM6J215FE(TE85L,F

SSM6J215FE(TE85L,F

Toshiba Electronic Devices and Storage Corporation

MOSFET P CH 20V 3.4A ES6

6782

TK5P60W,RVQ

TK5P60W,RVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 5.4A DPAK

2305

TK16A60W5,S4VX

TK16A60W5,S4VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15.8A TO220SIS

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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