Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK16J60W,S1VE

TK16J60W,S1VE

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

65

SSM3J133TU,LF

SSM3J133TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 5.5A UFM

36329

TPH1R306P1,L1Q

TPH1R306P1,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 100A 8SOP

0

TPN2R703NL,L1Q

TPN2R703NL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 45A 8TSON

2655

TK200F04N1L,LXGQ

TK200F04N1L,LXGQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 200A TO220SM

1385

TK10A60W,S4VX

TK10A60W,S4VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 9.7A TO220SIS

0

SSM6K341NU,LF

SSM6K341NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 6A 6UDFNB

1

SSM3K344R,LF

SSM3K344R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 3A SOT23F

8515

TJ60S06M3L,LXHQ

TJ60S06M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 60A DPAK

8972

SSM3K7002KFU,LF

SSM3K7002KFU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 400MA USM

2793

TK40E10N1,S1X

TK40E10N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 100V 90A TO220

3

TJ60S04M3L,LXHQ

TJ60S04M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 60A DPAK

3813

SSM3J340R,LF

SSM3J340R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 4A SOT23F

3761

TPH2R408QM,L1Q

TPH2R408QM,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 120A 8SOP

0

2SK3566(STA4,Q,M)

2SK3566(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 900V 2.5A TO220SIS

45

TK6A55DA(STA4,Q,M)

TK6A55DA(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 550V 5.5A TO220SIS

0

TPN1R603PL,L1Q

TPN1R603PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 80A 8TSON

15760

TK5A55D(STA4,Q,M)

TK5A55D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 550V 5A TO220SIS

0

TPH6R004PL,LQ

TPH6R004PL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 87A/49A 8SOP

0

TK7P65W,RQ

TK7P65W,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 6.8A DPAK

874

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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