Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK12J60U(F)

TK12J60U(F)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 12A TO3P

1327

TK20N60W5,S1VF

TK20N60W5,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 20A TO247

1

TPH1R005PL,L1Q

TPH1R005PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 45V 150A 8SOP

14765

TPH5200FNH,L1Q

TPH5200FNH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 250V 26A 8SOP

6052

TK12V60W,LVQ

TK12V60W,LVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 11.5A 4DFN

0

TK10A80W,S4X

TK10A80W,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 9.5A TO220SIS

0

TK065N65Z,S1F

TK065N65Z,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 38A TO247

49

SSM6J422TU,LF

SSM6J422TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 4A UF6

5994

TK125V65Z,LQ

TK125V65Z,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 24A 5DFN

5000

SSM3J377R,LF

SSM3J377R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 3.9A SOT23F

5455

SSM3J15CT(TPL3)

SSM3J15CT(TPL3)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 100MA CST3

2887

TK25S06N1L,LXHQ

TK25S06N1L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 25A DPAK

3652

SSM6K404TU,LF

SSM6K404TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 3A UF6

5910

SSM3K116TU,LF

SSM3K116TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 2.2A UFM

17203

TP89R103NL,LQ

TP89R103NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 15A 8SOP

0

TK13A55DA(STA4,QM)

TK13A55DA(STA4,QM)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 550V 12.5A TO220SIS

0

TK13A50D(STA4,Q,M)

TK13A50D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 13A TO220SIS

0

TPH1R204PB,L1Q

TPH1R204PB,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 150A 8SOP

17796

SSM3J65CTC,L3F

SSM3J65CTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 700MA CST3C

14656

TK8A10K3,S5Q

TK8A10K3,S5Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 8A TO220SIS

46

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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