Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TPH4R10ANL,L1Q

TPH4R10ANL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 92A/70A 8SOP

0

TK8Q65W,S1Q

TK8Q65W,S1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 7.8A IPAK

7

TK30A06N1,S4X

TK30A06N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 30A TO220SIS

681

TK62N60W,S1VF

TK62N60W,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 61.8A TO247

0

TK65S04N1L,LQ

TK65S04N1L,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 65A DPAK

2643

SSM3J114TU(TE85L)

SSM3J114TU(TE85L)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 1.8A UFM

609

TK10A60W5,S5VX

TK10A60W5,S5VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 9.7A TO220SIS

39

TK11A60D(STA4,Q,M)

TK11A60D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 11A TO220SIS

0

TK9A65W,S5X

TK9A65W,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 9.3A TO220SIS

0

2SK1828TE85LF

2SK1828TE85LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 50MA SC59

1986

SSM3K72CTC,L3F

SSM3K72CTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 150MA CST3C

405

SSM3J56MFV,L3F

SSM3J56MFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 800MA VESM

191742

TPH1R405PL,L1Q

TPH1R405PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 45V 120A 8SOP

4592

TK25N60X5,S1F

TK25N60X5,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 25A TO247

4

TK18E10K3,S1X(S

TK18E10K3,S1X(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 18A TO220-3

0

XPH3R114MC,L1XHQ

XPH3R114MC,L1XHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 100A 8SOP

3273

TPC8092,LQ(S

TPC8092,LQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 15A 8SOP

0

TK10J80E,S1E

TK10J80E,S1E

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 10A TO3P

0

TPH11006NL,LQ

TPH11006NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 17A 8SOP

307

TK5Q65W,S1Q

TK5Q65W,S1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 5.2A IPAK

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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