Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TJ15P04M3,RQ(S

TJ15P04M3,RQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 15A DPAK

0

TK60F10N1L,LXGQ

TK60F10N1L,LXGQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 60A TO220SM

1990

TK20A60U(Q,M)

TK20A60U(Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 20A TO220SIS

48

SSM3K72KCT,L3F

SSM3K72KCT,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 400MA CST3

52786

TPN3300ANH,LQ

TPN3300ANH,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 9.4A 8TSON

6031

TK6Q65W,S1Q

TK6Q65W,S1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 5.8A IPAK

0

TPN6R003NL,LQ

TPN6R003NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 27A 8TSON-ADV

0

SSM3K318R,LF

SSM3K318R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 2.5A SOT23F

9709

SSM3K333R,LF

SSM3K333R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 6A 2-3Z1A

2812

TK12Q60W,S1VQ

TK12Q60W,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 11.5A IPAK

0

TPC6111(TE85L,F,M)

TPC6111(TE85L,F,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 5.5A VS-6

2700

TK62N60X,S1F

TK62N60X,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 61.8A TO247

384

TK34A10N1,S4X

TK34A10N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 34A TO220SIS

10

SSM6K411TU(TE85L,F

SSM6K411TU(TE85L,F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 10A UF6

119

TPC8065-H,LQ(S

TPC8065-H,LQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 13A 8SOP

0

SSM3J35MFV,L3F

SSM3J35MFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 100MA VESM

7746

TK100L60W,VQ

TK100L60W,VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 100A TO3P

66

TK10A80E,S4X

TK10A80E,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 10A TO220SIS

65

TK20N60W,S1VF

TK20N60W,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 20A TO247

0

SSM6J414TU,LF

SSM6J414TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P CH 20V 6A UF6

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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