Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK5A65W,S5X

TK5A65W,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 5.2A TO220SIS

83

TJ40S04M3L,LXHQ

TJ40S04M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 40A DPAK

9721

SSM6J505NU,LF

SSM6J505NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 12V 12A 6UDFNB

5916

TPW4R008NH,L1Q

TPW4R008NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 116A 8DSOP

953

SSM3J355R,LF

SSM3J355R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 6A SOT23F

955

TPH5900CNH,L1Q

TPH5900CNH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 150V 9A 8SOP

0

TK35E10K3(S1SS-Q)

TK35E10K3(S1SS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 35A TO-220AB

0

SSM3J112TU,LF

SSM3J112TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 1.1A UFM

0

TPCA8055-H,LQ(M

TPCA8055-H,LQ(M

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 56A 8SOP

0

TK25A60X5,S5X

TK25A60X5,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 25A TO220SIS

99

TK3P50D,RQ(S

TK3P50D,RQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 3A DPAK

0

TJ80S04M3L,LXHQ

TJ80S04M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 80A DPAK

5378

SSM3K56CT,L3F

SSM3K56CT,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 800MA CST3

25874

TK31J60W5,S1VQ

TK31J60W5,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO3P

0

SSM3K324R,LF

SSM3K324R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 4A SOT-23F

2975

TJ20S04M3L,LXHQ

TJ20S04M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 20A DPAK

7845

TK56E12N1,S1X

TK56E12N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 120V 56A TO-220

0

TK110A10PL,S4X

TK110A10PL,S4X

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

112

SSM3J351R,LF

SSM3J351R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 3.5A SOT-23F

308

SSM3K7002CFU,LF

SSM3K7002CFU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 170MA USM

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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