Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK12A55D(STA4,Q,M)

TK12A55D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 550V 12A TO220SIS

0

TPC8062-H,LQ(CM

TPC8062-H,LQ(CM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 18A 8SOP

0

SSM3K341TU,LF

SSM3K341TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 6A UFM

10572

SSM3K15F,LF

SSM3K15F,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA S-MINI

1676

TK35E08N1,S1X

TK35E08N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 55A TO220

0

TK7Q60W,S1VQ

TK7Q60W,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 7A IPAK

0

TPH3R506PL,LQ

TPH3R506PL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 94A 8SOP

0

SSM3K15ACT,L3F

SSM3K15ACT,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA CST3

20296

TPHR9003NL,L1Q

TPHR9003NL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 60A 8SOP

525

TPHR6503PL,L1Q

TPHR6503PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 150A 8SOP

12366

TK6A80E,S4X

TK6A80E,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 6A TO220SIS

19

XPH3R206NC,L1XHQ

XPH3R206NC,L1XHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 70A 8SOP

9763

TK14E65W,S1X

TK14E65W,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13.7A TO220

5

TK15S04N1L,LQ

TK15S04N1L,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 15A DPAK

72

SSM3J15F,LF

SSM3J15F,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 100MA S-MINI

4763

SSM3J338R,LF

SSM3J338R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 12V 6A SOT23F

0

TP86R203NL,LQ

TP86R203NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 19A 8SOP

1959

SSM3K345R,LF

SSM3K345R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CHANNEL 20V 4A SOT23F

5347

TK31J60W,S1VQ

TK31J60W,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO3P

21

TK16E60W5,S1VX

TK16E60W5,S1VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15.8A TO220

34

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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