Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SSM3K122TU,LF

SSM3K122TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 2A UFM

5398

TJ60S04M3L(T6L1,NQ

TJ60S04M3L(T6L1,NQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 60A DPAK

0

TPH6400ENH,L1Q

TPH6400ENH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 200V 13A 8SOP

6956

2SK209-GR(TE85L,F)

2SK209-GR(TE85L,F)

Toshiba Electronic Devices and Storage Corporation

TRANS SJT N-CH 10MA SC59

2955

SSM3K347R,LF

SSM3K347R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 38V 2A SOT23F

3000

TPH3R704PL,L1Q

TPH3R704PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 92A 8SOP

13845

SSM3J378R,LXHF

SSM3J378R,LXHF

Toshiba Electronic Devices and Storage Corporation

AECQ MOSFET PCH -20V -6A SOT23F

0

TK8S06K3L(T6L1,NQ)

TK8S06K3L(T6L1,NQ)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 8A DPAK

0

TW070J120B,S1Q

TW070J120B,S1Q

Toshiba Electronic Devices and Storage Corporation

SICFET N-CH 1200V 36A TO3P

273

TPH4R803PL,LQ

TPH4R803PL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 48A 8SOP

4783

TPWR8004PL,L1Q

TPWR8004PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 150A 8DSOP

772

TK160F10N1L,LQ

TK160F10N1L,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 160A TO220SM

0

SSM3K17FU,LF

SSM3K17FU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 50V 100MA USM

52419

SSM3J374R,LF

SSM3J374R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 4A SOT23F

515

TPH3R704PC,LQ

TPH3R704PC,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 82A 8SOP

6000

TK10A60D(STA4,Q,M)

TK10A60D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 10A TO220SIS

0

SSM3J140TU,LF

SSM3J140TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 4.4A UFM

2355

2SK2009TE85LF

2SK2009TE85LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 200MA SC59-3

2138

TK560A65Y,S4X

TK560A65Y,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 7A TO220SIS

33

TK65G10N1,RQ

TK65G10N1,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 65A D2PAK

2461

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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