Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TPCA8051-H(T2L1,VM

TPCA8051-H(T2L1,VM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 28A 8SOP

2018

SSM3J353F,LF

SSM3J353F,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 2A S-MINI

3115

TK14N65W,S1F

TK14N65W,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13.7A TO247

17

TK560A60Y,S4X

TK560A60Y,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 7A TO220SIS

102

TK58E06N1,S1X

TK58E06N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 58A TO220

30

TPCA8026(TE12L,Q,M

TPCA8026(TE12L,Q,M

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 45A 8SOP

9153

SSM6J512NU,LF

SSM6J512NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 12V 10A 6UDFNB

1188

SSM6J212FE,LF

SSM6J212FE,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 4A ES6

9

TK32E12N1,S1X

TK32E12N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 120V 60A TO-220

0

SSM6K405TU,LF

SSM6K405TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 2A UF6

5990

TJ30S06M3L,LXHQ

TJ30S06M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 30A DPAK

3754

TPH3R003PL,LQ

TPH3R003PL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 88A 8SOP

0

SSM3K35AMFV,L3F

SSM3K35AMFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 250MA VESM

36919

TK50P04M1(T6RSS-Q)

TK50P04M1(T6RSS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 50A DP

1636

TK7P50D(T6RSS-Q)

TK7P50D(T6RSS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 7A DPAK

0

TK7A65D(STA4,Q,M)

TK7A65D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 7A TO220SIS

0

TK4R4P06PL,RQ

TK4R4P06PL,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CHANNEL 60V 58A DPAK

1736

TK15A60D(STA4,Q,M)

TK15A60D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15A TO220SIS

0

TK7J90E,S1E

TK7J90E,S1E

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 900V 7A TO3P

12

SSM3J64CTC,L3F

SSM3J64CTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 12V 1A CST3C

19247

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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