Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
SCTWA35N65G2V STMicroelectronics	TRANS SJT N-CH 650V 45A TO247	39
STW21NM60ND STMicroelectronics	MOSFET N-CH 600V 17A TO247-3	191
STL36N55M5 STMicroelectronics	MOSFET N-CH 550V 22.5A 4PWRFLAT	1551
STD12NF06T4 STMicroelectronics	MOSFET N-CH 60V 12A DPAK	1890
SCT10N120AG STMicroelectronics	SICFET N-CH 1200V 12A HIP247	550
STF11N60DM2 STMicroelectronics	MOSFET N-CH 600V 10A TO220FP	1920
STW65N80K5 STMicroelectronics	MOSFET N-CH 800V 46A TO247	288
STF13N95K3 STMicroelectronics	MOSFET N-CH 950V 10A TO220FP	0
STFU10N80K5 STMicroelectronics	MOSFET N-CH 800V 9A TO220FP	1980
STB30N80K5 STMicroelectronics	MOSFET N-CHANNEL 800V 24A D2PAK	779
STFW12N120K5 STMicroelectronics	MOSFET N-CH 1200V 12A ISOWATT	0
STD130N4F6AG STMicroelectronics	MOSFET N-CH 40V 80A DPAK	0
STI260N6F6 STMicroelectronics	MOSFET N-CH 75V 120A I2PAK	0
STW21N65M5 STMicroelectronics	MOSFET N-CH 650V 17A TO247-3	86
STB47N60DM6AG STMicroelectronics	AUTOMOTIVE-GRADE N-CHANNEL 600 V	0
STB35N65M5 STMicroelectronics	MOSFET N-CH 650V 27A D2PAK	965
STB200N6F3 STMicroelectronics	MOSFET N-CH 60V 120A D2PAK	0
STN3NF06 STMicroelectronics	MOSFET N-CH 60V 4A SOT-223	3810
STB7NK80Z-1 STMicroelectronics	MOSFET N-CH 800V 5.2A I2PAK	0
STH240N10F7-6 STMicroelectronics	MOSFET N-CH 100V 180A H2PAK-6	1603

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS